EINZELHEITEN ZU DEN PRODUKTEN

Zu Hause > Produits >

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet

Produits

Kupferplattierte Laminate

Kontakt mit uns

Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

Kontaktieren Sie uns jetzt

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet

MOQ:	1Stk
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Werktage
Zahlungsmethode:	T/T
Lieferkapazität:	5000 Stück pro Monat

Einzelheiten Informationen

Produktbeschreibung

Einzelheiten

Herkunftsort

China

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-332.V1.0

Teilenummer:

CLTE-MW

Laminatstärke:

0,003 Zoll (0,076 mm) ± 0,0005 Zoll 0,004 Zoll (0,102 mm) ± 0,0005 Zoll 0,005 Zoll (0,127 mm) ± 0,00

Laminatgröße:

12" x 18" (305 x 457 mm) 24" x 18" (610 x 457 mm)

Kupfergewicht:

Umgekehrt behandelte elektrolytisch abgeschiedene Kupferfolie 1/2 oz. (18µm) 1 Unze. (35 µm) 2 oz. (

Hervorheben:

CLTE-MW PCB high frequency laminate

copper clad sheet PCB material

high frequency copper clad laminates

Produktbeschreibung

CLTE-MW laminates are ceramic-filled, woven glass reinforced PTFE composites, engineered to offer circuit designers a cost-effective, high-performance material solution. This unique laminate system is particularly well-suited for applications where thickness constraints exist due to physical or electrical requirements.

With seven available thickness options ranging from 3 mils to 10 mils, CLTE-MW™ ensures optimal signal-to-ground spacing for today's 5G and other millimeter-wave designs. A variety of copper foil options are available, including rolled, reverse-treated ED, and standard ED copper. Resistive foil and metal plate options are also available upon request.

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet 0

Features and Benefits

Excellent Dimensional Stability: Critical for maintaining registration of small circuit features
Low X, Y & Z-Axis CTE: Ensures reliable mechanical performance under thermally challenging environments
Low Loss Tangent: Minimizes circuit losses for improved efficiency
Available in Thicknesses from 3-10 mils: Suitable for very high frequency applications requiring precise impedance control

Typical Applications

Commercial Communications and Avionics
Military and Aerospace Applications
Microwave Feed Networks
Phase Sensitive Electronic Structures
Satellite Communication Systems
Passive Components (couplers, filters, and baluns)

Properties	Typical Value	Units	Test Conditions	Test Method
Electrical Properties
Dielectric Constant (process)	2.94–3.02 ±0.04	–	23°C @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant (design)	3.03–3.10	–	C-24/23/50, 8–40 GHz	Microstrip Differential Phase Length
Dissipation Factor	0.0015	–	23°C @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant	-35	ppm/°C	0–100°C, 10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity	1.3×10⁷	MΩ·cm	C96/35/90	IPC TM-650 2.5.17.1
Surface Resistivity	2.5×10⁶	MΩ	C96/35/90	IPC TM-650 2.5.17.1
Dielectric Strength	630	V/mil	–	IPC TM-650 2.5.6.2
Dielectric Breakdown	44	kV	D-48/50	IPC TM-650 2.5.6
Comparative Tracking Index (CTI)	600	V	C-40/23/50	UL-746A, ASTM D6054
Thermal Properties
Decomposition Temperature (Td)	500	°C	2 hrs @ 105°C, 5% Weight Loss	IPC TM-650 2.3.40
CTE (x-axis)	8	ppm/°C	-55°C to 288°C	IPC TM-650 2.4.41
CTE (y-axis)	8	ppm/°C	-55°C to 288°C	IPC TM-650 2.4.41
CTE (z-axis)	30	ppm/°C	–	IPC TM-650 2.4.24
Thermal Conductivity	0.42	W/(m·K)	Z Direction	ASTM D5470
Time to Delamination (T288)	>60	minutes	10 s @ 288°C	IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength	1.1 (6.0)	N/mm (lbs/in)	as-received, 35 μm foil	IPC TM-650 2.4.8
Flexural Strength (MD, CMD)	113, 99 (16.4, 14.4)	MPa (ksi)	25°C ±3°C	ASTM D790
Tensile Strength (MD, CMD)	83, 80 (12.0, 11.6)	MPa (ksi)	23°C @ 50% RH	ASTM D3039/D3039-14
Flex Modulus (MD, CMD)	6468, 6360 (938.1, 922.4)	MPa (ksi)	25°C ±3°C	IPC TM-650 2.4.4
Dimensional Stability (MD, CMD)	0.22, 0.22	mil/inch	after etch + bake	IPC-TM-650 2.4.39a
Physical & Environmental Properties
Flammability	V-0	–	–	UL 94
Moisture Absorption	0.03	%	E1/105+D48/50	IPC TM-650 2.6.2.1
Density	2.1	g/cm³	C24/23/50	ASTM D792
Specific Heat Capacity	0.93	J/g·K	2 hrs at 105°C	ASTM E2716
NASA Outgassing (TML)	0.03	%	–	ASTM E595
NASA Outgassing (CVCM)	<0.01	%	–	ASTM E595

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet 1

Tags:

0.1 mm Kupferplattiertes Laminat,

BME217 Kupferplattiertes Laminat,

12 mm Kupferplattiertes Laminat

Empfohlene Produkte

CLTE-XT PCB Material High Frequency Laminates Copper Clad Sheet

Kontaktieren Sie uns jetzt

RT duroid 6002 PCB Material High Frequency Laminates Copper Clad Sheet

Kontaktieren Sie uns jetzt

F4BTMS294 Substrate High Frequency Laminates Copper Clad Sheet

Kontaktieren Sie uns jetzt

RT duroid 6202 PCB Material Hochfrequenz-Laminate Kupferkaschierte Platte

Kontaktieren Sie uns jetzt

NT1 Verpackung von Stoffen RT Verpackung von Waren

Kontaktieren Sie uns jetzt

F4BME275 Kupferplatten aus hochfrequenten Laminaten

Kontaktieren Sie uns jetzt

F4BM275 Substrat hochfrequente Laminate Kupferplatten

Kontaktieren Sie uns jetzt

EINZELHEITEN ZU DEN PRODUKTEN

Produits

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

Brett PWB-fr4

PWB-Schablone

Metallkern PWB

Kupferplattierte Laminate

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet

MOQ:	1Stk
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Werktage
Zahlungsmethode:	T/T
Lieferkapazität:	5000 Stück pro Monat

Einzelheiten

Produktbeschreibung

Einzelheiten

Herkunftsort

China

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-332.V1.0

Teilenummer:

CLTE-MW

Laminatstärke:

0,003 Zoll (0,076 mm) ± 0,0005 Zoll 0,004 Zoll (0,102 mm) ± 0,0005 Zoll 0,005 Zoll (0,127 mm) ± 0,00

Laminatgröße:

12" x 18" (305 x 457 mm) 24" x 18" (610 x 457 mm)

Kupfergewicht:

Umgekehrt behandelte elektrolytisch abgeschiedene Kupferfolie 1/2 oz. (18µm) 1 Unze. (35 µm) 2 oz. (

Min Bestellmenge:

1Stk

Preis:

USD9.99-99.99

Verpackung Informationen:

Vakuumbeutel+Kartons

Lieferzeit:

8-9 Werktage

Zahlungsbedingungen:

T/T

Versorgungsmaterial-Fähigkeit:

5000 Stück pro Monat

Hervorheben

CLTE-MW PCB high frequency laminate

copper clad sheet PCB material

high frequency copper clad laminates

Produktbeschreibung

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet 0

Features and Benefits

Excellent Dimensional Stability: Critical for maintaining registration of small circuit features
Low X, Y & Z-Axis CTE: Ensures reliable mechanical performance under thermally challenging environments
Low Loss Tangent: Minimizes circuit losses for improved efficiency
Available in Thicknesses from 3-10 mils: Suitable for very high frequency applications requiring precise impedance control

Typical Applications

Commercial Communications and Avionics
Military and Aerospace Applications
Microwave Feed Networks
Phase Sensitive Electronic Structures
Satellite Communication Systems
Passive Components (couplers, filters, and baluns)

Properties	Typical Value	Units	Test Conditions	Test Method
Electrical Properties
Dielectric Constant (process)	2.94–3.02 ±0.04	–	23°C @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant (design)	3.03–3.10	–	C-24/23/50, 8–40 GHz	Microstrip Differential Phase Length
Dissipation Factor	0.0015	–	23°C @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant	-35	ppm/°C	0–100°C, 10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity	1.3×10⁷	MΩ·cm	C96/35/90	IPC TM-650 2.5.17.1
Surface Resistivity	2.5×10⁶	MΩ	C96/35/90	IPC TM-650 2.5.17.1
Dielectric Strength	630	V/mil	–	IPC TM-650 2.5.6.2
Dielectric Breakdown	44	kV	D-48/50	IPC TM-650 2.5.6
Comparative Tracking Index (CTI)	600	V	C-40/23/50	UL-746A, ASTM D6054
Thermal Properties
Decomposition Temperature (Td)	500	°C	2 hrs @ 105°C, 5% Weight Loss	IPC TM-650 2.3.40
CTE (x-axis)	8	ppm/°C	-55°C to 288°C	IPC TM-650 2.4.41
CTE (y-axis)	8	ppm/°C	-55°C to 288°C	IPC TM-650 2.4.41
CTE (z-axis)	30	ppm/°C	–	IPC TM-650 2.4.24
Thermal Conductivity	0.42	W/(m·K)	Z Direction	ASTM D5470
Time to Delamination (T288)	>60	minutes	10 s @ 288°C	IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength	1.1 (6.0)	N/mm (lbs/in)	as-received, 35 μm foil	IPC TM-650 2.4.8
Flexural Strength (MD, CMD)	113, 99 (16.4, 14.4)	MPa (ksi)	25°C ±3°C	ASTM D790
Tensile Strength (MD, CMD)	83, 80 (12.0, 11.6)	MPa (ksi)	23°C @ 50% RH	ASTM D3039/D3039-14
Flex Modulus (MD, CMD)	6468, 6360 (938.1, 922.4)	MPa (ksi)	25°C ±3°C	IPC TM-650 2.4.4
Dimensional Stability (MD, CMD)	0.22, 0.22	mil/inch	after etch + bake	IPC-TM-650 2.4.39a
Physical & Environmental Properties
Flammability	V-0	–	–	UL 94
Moisture Absorption	0.03	%	E1/105+D48/50	IPC TM-650 2.6.2.1
Density	2.1	g/cm³	C24/23/50	ASTM D792
Specific Heat Capacity	0.93	J/g·K	2 hrs at 105°C	ASTM E2716
NASA Outgassing (TML)	0.03	%	–	ASTM E595
NASA Outgassing (CVCM)	<0.01	%	–	ASTM E595

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet 1

Tags: