F4BME275 Substrate High Frequency Laminates Copper Clad Sheet

The F4BME275 is a precision-engineered high-frequency laminate manufactured from glass fabric, PTFE (polytetrafluoroethylene) resin, and PTFE film through strictly controlled lamination processes. Compared to standard F4B materials, it delivers enhanced electrical performance including a wider dielectric constant range, lower dissipation factor, higher insulation resistance, and superior stability, positioning it as a reliable alternative to equivalent international products.

The F4BM275 and F4BME275 variants share an identical dielectric core but feature different copper foil configurations:

F4BM275 incorporates ED (electrodeposited) copper foil, ideal for applications without Passive Intermodulation (PIM) requirements.

F4BME275 utilizes reverse-treated RTF (reverse treated foil) copper foil, delivering excellent PIM performance, enabling finer circuit resolution, and achieving lower conductor loss.

By precisely adjusting the PTFE-to-glass fabric ratio, both F4BM and F4BME achieve targeted dielectric constants while maintaining low loss and superior dimensional stability. Higher dielectric constant grades contain increased glass proportions, resulting in enhanced dimensional stability, reduced coefficient of thermal expansion (CTE), and improved temperature drift characteristics, though with a marginal increase in dielectric loss.

Product Features

• DK2.17 ～3 is optional, and DK can be customized
• Low loss
• F4BME with RTF copper foil delivers excellent PIM performance
• Diverse sizes for cost savings
• Radiation resistance and low outgassing
• Commercialized, mass-producible, and cost-effective

Typical Applications

• Microwave, RF, radar
• Phase shifters, passive components
• Power dividers, couplers, combiners
• Feeding networks, phased array antennas
• Satellite communications, base station antennas