logo
produits
EINZELHEITEN ZU DEN PRODUKTEN
Zu Hause > Produits >
RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
Produits

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

Brett PWB-fr4

PWB-Schablone

Metallkern PWB

Kupferplattierte Laminate
Kontakt mit uns
Ms. Ivy Deng
sales10@bichengpcb.com
86-755-27374847
Kontaktieren Sie uns jetzt
RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
  • Name

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet

MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Werktage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Stück pro Monat
Einzelheiten Informationen
Produktbeschreibung
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-332.V1.0
Teilenummer:
RT Duroid 6202
Laminatstärke:
0,005 Zoll (0,127 mm) +/- 0,0005 Zoll 0,020 Zoll (0,508 mm) +/- 0,0010 Zoll 0,030 Zoll (0,762 mm) +/
Laminatgröße:
12 Zoll x 18 Zoll (305 mm x 457 mm) 24 Zoll x 18 Zoll (610 mm x 457 mm)
Kupfergewicht:
Galvanisch abgeschiedene Kupferfolie ½ oz. (18 µm) HH/HH 1 oz. (35 µm) H1/H1 gerollte Kupferfolie ½
Hervorheben:

RT duroid 6202 PCB material

,

high frequency copper clad laminate

,

duroid 6202 copper clad sheet

Produktbeschreibung

RT/duroid 6202 is a high-frequency circuit material formulated as a low-loss, low-dielectric-constant laminate. It delivers superior electrical and mechanical properties essential for designing complex microwave structures that require both mechanical reliability and electrical stability.

 

The inclusion of limited woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch), which often eliminates the need for double etching to achieve tight positional tolerances.

 

Cladding Options and Dielectric Thicknesses

Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Features and Benefits

  • Low Loss: Ensures excellent high-frequency performance
  • Tight εr and Thickness Control: Provides consistent electrical characteristics
  • Excellent Electrical and Mechanical Properties: Enables reliable circuit construction
  • Extremely Low Thermal Coefficient of Dielectric Constant: Maintains electrical stability across temperature variations
  • In-Plane Expansion Coefficient Matched to Copper: Enhances reliability for surface-mounted assemblies and plated through-holes
  • Very Low Etch Shrinkage: Improves precision in circuit fabrication

 

Typical Applications

  • Phased Array Antennas
  • Ground-Based and Airborne Radar Systems
  • Global Positioning System (GPS) Antennas
  • Power Backplanes
  • High-Reliability Complex Multilayer Circuits
  • Commercial Airline Collision Avoidance Systems
  • Beam Forming Networks

 

Property

Dielectric Constant ε

r

Typical Value

2.94 ± 0.04 [3]

Direction

Z

Units

 

-

Conditions

10GHz/23°C

Test Method

IPC-TM-650, 2.5.5.5
Dissipation Factor, TAN δ 0.0015 Z - 10 GHz/23°C IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr +5 Z ppm/°C

10 GHz

-50 to +150°C

 IPC-TM-650, 2.5.5.5
Volume Resistivity 106 Z Mohm cm A ASTM D257
Surface Resistivity 109 Z Mohm A ASTM D257
Tensile Modulus 1007 (146) X, Y MPa (kpsi)

 

23°C

 

ASTM D638
Ultimate Stress 30 (4.3) X, Y MPs (kpsi)
Ultimate Strain 4.9 X, Y %
Compressive Modulus 1035 (150) Z MPa (kpsi)   ASTM D638
Moisture Absorption 0.04 - %

D23/24

D48/50

IPC-TM-650, 2.6.2.1

ASTM D570
Thermal Conductivity 0.68 - W/m/K 80°C ASTM C518

Coefficient of Thermal

Expansion (-55 to 288 °C)

15

15

30

X

Y

Z

 

ppm/°C

 

23°C/50% RH

 IPC-TM-650 2.4.41
Dimensional Stability 0.07 X, Y mm/m (mil/inch) after etch +E/150 IPC-TM-650, 2.4.3.9
Td 500   °CTGA   ASTM D3850
Density 2.1   gm/cm3   ASTM D792
Specific Heat 0.93 (0.22) - J/g/K (BTU/lb/°F) - Calculated
Copper Peel 9.1 (1.6)   lbs/in (N/mm)   IPC-TM-650 2.4.8
Flammability V-O       UL 94
Lead-Free Process Com- patible YES        

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 1

Tags: 

0.1 mm Kupferplattiertes Laminat,  

BME217 Kupferplattiertes Laminat,  

12 mm Kupferplattiertes Laminat

Empfohlene Produkte
F4BME275 Substrate High Frequency Laminates Copper Clad Sheet

F4BME275 Substrate High Frequency Laminates Copper Clad Sheet

Kontaktieren Sie uns jetzt
F4BM275 Substrate High Frequency Laminates Copper Clad Sheet

F4BM275 Substrate High Frequency Laminates Copper Clad Sheet

Kontaktieren Sie uns jetzt
F4BME265 Substrate High Frequency Laminates Copper Clad Sheet

F4BME265 Substrate High Frequency Laminates Copper Clad Sheet

Kontaktieren Sie uns jetzt
F4BM265 Substrate High Frequency Laminates Copper Clad Sheet

F4BM265 Substrate High Frequency Laminates Copper Clad Sheet

Kontaktieren Sie uns jetzt
F4BTMS265 Substrate High Frequency Laminates Copper Clad Sheet

F4BTMS265 Substrate High Frequency Laminates Copper Clad Sheet

Kontaktieren Sie uns jetzt
TLX-6 Unterlage mit Kupferplatten aus Hochfrequenz-Laminaten

TLX-6 Unterlage mit Kupferplatten aus Hochfrequenz-Laminaten

Kontaktieren Sie uns jetzt
TLX-7 Unterlage mit hochfrequenten Laminaten Kupferplatten

TLX-7 Unterlage mit hochfrequenten Laminaten Kupferplatten

Kontaktieren Sie uns jetzt
produits
EINZELHEITEN ZU DEN PRODUKTEN
Produits

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

Brett PWB-fr4

PWB-Schablone

Metallkern PWB

Kupferplattierte Laminate
RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
  • Name
RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet
MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Werktage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Stück pro Monat
Einzelheiten
Produktbeschreibung
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-332.V1.0
Teilenummer:
RT Duroid 6202
Laminatstärke:
0,005 Zoll (0,127 mm) +/- 0,0005 Zoll 0,020 Zoll (0,508 mm) +/- 0,0010 Zoll 0,030 Zoll (0,762 mm) +/
Laminatgröße:
12 Zoll x 18 Zoll (305 mm x 457 mm) 24 Zoll x 18 Zoll (610 mm x 457 mm)
Kupfergewicht:
Galvanisch abgeschiedene Kupferfolie ½ oz. (18 µm) HH/HH 1 oz. (35 µm) H1/H1 gerollte Kupferfolie ½
Min Bestellmenge:
1Stk
Preis:
USD9.99-99.99
Verpackung Informationen:
Vakuumbeutel+Kartons
Lieferzeit:
8-9 Werktage
Zahlungsbedingungen:
T/T
Versorgungsmaterial-Fähigkeit:
5000 Stück pro Monat
Hervorheben

RT duroid 6202 PCB material

,

high frequency copper clad laminate

,

duroid 6202 copper clad sheet

Produktbeschreibung

RT/duroid 6202 is a high-frequency circuit material formulated as a low-loss, low-dielectric-constant laminate. It delivers superior electrical and mechanical properties essential for designing complex microwave structures that require both mechanical reliability and electrical stability.

 

The inclusion of limited woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch), which often eliminates the need for double etching to achieve tight positional tolerances.

 

Cladding Options and Dielectric Thicknesses

Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Features and Benefits

  • Low Loss: Ensures excellent high-frequency performance
  • Tight εr and Thickness Control: Provides consistent electrical characteristics
  • Excellent Electrical and Mechanical Properties: Enables reliable circuit construction
  • Extremely Low Thermal Coefficient of Dielectric Constant: Maintains electrical stability across temperature variations
  • In-Plane Expansion Coefficient Matched to Copper: Enhances reliability for surface-mounted assemblies and plated through-holes
  • Very Low Etch Shrinkage: Improves precision in circuit fabrication

 

Typical Applications

  • Phased Array Antennas
  • Ground-Based and Airborne Radar Systems
  • Global Positioning System (GPS) Antennas
  • Power Backplanes
  • High-Reliability Complex Multilayer Circuits
  • Commercial Airline Collision Avoidance Systems
  • Beam Forming Networks

 

Property

Dielectric Constant ε

r

Typical Value

2.94 ± 0.04 [3]

Direction

Z

Units

 

-

Conditions

10GHz/23°C

Test Method

IPC-TM-650, 2.5.5.5
Dissipation Factor, TAN δ 0.0015 Z - 10 GHz/23°C IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr +5 Z ppm/°C

10 GHz

-50 to +150°C

 IPC-TM-650, 2.5.5.5
Volume Resistivity 106 Z Mohm cm A ASTM D257
Surface Resistivity 109 Z Mohm A ASTM D257
Tensile Modulus 1007 (146) X, Y MPa (kpsi)

 

23°C

 

ASTM D638
Ultimate Stress 30 (4.3) X, Y MPs (kpsi)
Ultimate Strain 4.9 X, Y %
Compressive Modulus 1035 (150) Z MPa (kpsi)   ASTM D638
Moisture Absorption 0.04 - %

D23/24

D48/50

IPC-TM-650, 2.6.2.1

ASTM D570
Thermal Conductivity 0.68 - W/m/K 80°C ASTM C518

Coefficient of Thermal

Expansion (-55 to 288 °C)

15

15

30

X

Y

Z

 

ppm/°C

 

23°C/50% RH

 IPC-TM-650 2.4.41
Dimensional Stability 0.07 X, Y mm/m (mil/inch) after etch +E/150 IPC-TM-650, 2.4.3.9
Td 500   °CTGA   ASTM D3850
Density 2.1   gm/cm3   ASTM D792
Specific Heat 0.93 (0.22) - J/g/K (BTU/lb/°F) - Calculated
Copper Peel 9.1 (1.6)   lbs/in (N/mm)   IPC-TM-650 2.4.8
Flammability V-O       UL 94
Lead-Free Process Com- patible YES        

 

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 1

Tags: 

0.1 mm Kupferplattiertes Laminat,

BME217 Kupferplattiertes Laminat,

12 mm Kupferplattiertes Laminat

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Sitemap |  Datenschutzrichtlinie | China gut Qualität Rf-PWB-Brett Lieferant. Urheberrecht © 2020-2026 Bicheng Electronics Technology Co., Ltd - Alle. Alle Rechte vorbehalten.