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High Frequency CuClad233 RF PCB Substrate

High Frequency CuClad233 RF PCB Substrate

MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Werktage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Stück pro Monat
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-332.V1.0
Teilenummer:
CuClad233
Laminatstärke:
0,254 mm 0,508 mm 0,787 mm 1,575 mm
Laminatgröße:
18''X12''(457X305mm); 18''X24''(457X610mm)
Kupfergewicht:
0,5 Unzen (0,018 mm), 1 Unze (0,035 mm)
Hervorheben:

High Frequency CuClad233 PCB

,

RF PCB substrate material

,

Copper clad laminate with warranty

Produktbeschreibung

CuClad 233 laminates are woven fiberglass-reinforced PTFE composite materials engineered specifically for deployment as printed circuit board (PCB) substrates. Leveraging precise regulation of the fiberglass-to-PTFE ratio, CuClad 233 laminates provide a versatile product range—encompassing grades with ultra-low dielectric constant (Dk) and loss tangent, as well as highly reinforced variants optimized for enhanced dimensional stability.


The woven fiberglass reinforcement integral to CuClad series materials delivers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency over PTFE-coated fiberglass cloth not only enables a broader spectrum of available Dk values, but also yields laminates with improved dielectric constant uniformity relative to comparable nonwoven fiberglass-reinforced alternatives. These performance attributes position CuClad laminates as a high-value solution for RF filters, couplers, and low-noise amplifiers (LNAs).


A defining characteristic of CuClad 233 laminates is their cross-plied architecture: alternating layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This design achieves true electrical and mechanical isotropy in the XY plane—a proprietary feature exclusive to CuClad 233 laminates that no other woven or nonwoven fiberglass-reinforced PTFE laminates can match. This exceptional level of isotropy is critical for demanding applications such as phased array antennas.


With a dielectric constant (Er) of 2.33, CuClad 233 employs a balanced fiberglass-to-PTFE ratio that optimizes low dielectric constant and improved dissipation factor, without compromising core mechanical performance.

 

High Frequency CuClad233 RF PCB Substrate 0


Features & Benefits

  • Cross-plied woven fiberglass architecture with alternating plies oriented at 90°
  • High PTFE-to-glass ratio
  • Superior dielectric constant uniformity vs. comparable nonwoven fiberglass-reinforced laminates
  • True electrical and mechanical isotropy in the XY plane
  • Ultra-low signal loss
  • Ideal for dielectric constant (Er)-sensitive circuit designs


Typical Applications

  • Military electronics systems (radars, electronic countermeasures [ECM], electronic support measures [ESM])
  • Microwave components (low-noise amplifiers [LNAs], filters, couplers, etc.)

 

Property Test Method Condition CuClad 233
Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.33
Dielectric Constant @1MHz IPC TM-650 2.5.5.3 C23/50 2.33
Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0013
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 Adapted -10°C to +140°C -161
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 8.0 x 10 8
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 2.4 x 10 6
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 510, 414
Tensile Strength (kpsi) ASTM D-882 A, 23°C 10.3, 9.8
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 276
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 371
Dielectric Breakdown (kv) ASTM D-149 D48/50 > 45
Specific Gravity (g/cm3) ASTM D-792 Method A A, 23°C 2.26
Water Absorption (%) MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 E1/105 + D24/23 0.02

Coefficient of Thermal Expansion (ppm/°C)

X Axis

Y Axis

Z Axis

IPC TM-650 2.4.24 Mettler 3000

Thermomechanical Analyzer

0°C to 100°C

 

23

24

194

Thermal Conductivity ASTM E-1225 100°C 0.26

Outgassing

Total Mass Loss (%)

Collected Volatile

Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±)

NASA SP-R-0022A

Maximum 1.00%

Maximum 0.10%

125°C, ≤ 10-6 torr

 

0.01

0.01

0.00

NO

Flammability UL 94 Vertical Burn IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0

 

High Frequency CuClad233 RF PCB Substrate 1

produits
EINZELHEITEN ZU DEN PRODUKTEN
High Frequency CuClad233 RF PCB Substrate
MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Werktage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Stück pro Monat
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-332.V1.0
Teilenummer:
CuClad233
Laminatstärke:
0,254 mm 0,508 mm 0,787 mm 1,575 mm
Laminatgröße:
18''X12''(457X305mm); 18''X24''(457X610mm)
Kupfergewicht:
0,5 Unzen (0,018 mm), 1 Unze (0,035 mm)
Min Bestellmenge:
1Stk
Preis:
USD9.99-99.99
Verpackung Informationen:
Vakuumbeutel+Kartons
Lieferzeit:
8-9 Werktage
Zahlungsbedingungen:
T/T
Versorgungsmaterial-Fähigkeit:
5000 Stück pro Monat
Hervorheben

High Frequency CuClad233 PCB

,

RF PCB substrate material

,

Copper clad laminate with warranty

Produktbeschreibung

CuClad 233 laminates are woven fiberglass-reinforced PTFE composite materials engineered specifically for deployment as printed circuit board (PCB) substrates. Leveraging precise regulation of the fiberglass-to-PTFE ratio, CuClad 233 laminates provide a versatile product range—encompassing grades with ultra-low dielectric constant (Dk) and loss tangent, as well as highly reinforced variants optimized for enhanced dimensional stability.


The woven fiberglass reinforcement integral to CuClad series materials delivers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency over PTFE-coated fiberglass cloth not only enables a broader spectrum of available Dk values, but also yields laminates with improved dielectric constant uniformity relative to comparable nonwoven fiberglass-reinforced alternatives. These performance attributes position CuClad laminates as a high-value solution for RF filters, couplers, and low-noise amplifiers (LNAs).


A defining characteristic of CuClad 233 laminates is their cross-plied architecture: alternating layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This design achieves true electrical and mechanical isotropy in the XY plane—a proprietary feature exclusive to CuClad 233 laminates that no other woven or nonwoven fiberglass-reinforced PTFE laminates can match. This exceptional level of isotropy is critical for demanding applications such as phased array antennas.


With a dielectric constant (Er) of 2.33, CuClad 233 employs a balanced fiberglass-to-PTFE ratio that optimizes low dielectric constant and improved dissipation factor, without compromising core mechanical performance.

 

High Frequency CuClad233 RF PCB Substrate 0


Features & Benefits

  • Cross-plied woven fiberglass architecture with alternating plies oriented at 90°
  • High PTFE-to-glass ratio
  • Superior dielectric constant uniformity vs. comparable nonwoven fiberglass-reinforced laminates
  • True electrical and mechanical isotropy in the XY plane
  • Ultra-low signal loss
  • Ideal for dielectric constant (Er)-sensitive circuit designs


Typical Applications

  • Military electronics systems (radars, electronic countermeasures [ECM], electronic support measures [ESM])
  • Microwave components (low-noise amplifiers [LNAs], filters, couplers, etc.)

 

Property Test Method Condition CuClad 233
Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.33
Dielectric Constant @1MHz IPC TM-650 2.5.5.3 C23/50 2.33
Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0013
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 Adapted -10°C to +140°C -161
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 8.0 x 10 8
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 2.4 x 10 6
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 510, 414
Tensile Strength (kpsi) ASTM D-882 A, 23°C 10.3, 9.8
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 276
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 371
Dielectric Breakdown (kv) ASTM D-149 D48/50 > 45
Specific Gravity (g/cm3) ASTM D-792 Method A A, 23°C 2.26
Water Absorption (%) MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 E1/105 + D24/23 0.02

Coefficient of Thermal Expansion (ppm/°C)

X Axis

Y Axis

Z Axis

IPC TM-650 2.4.24 Mettler 3000

Thermomechanical Analyzer

0°C to 100°C

 

23

24

194

Thermal Conductivity ASTM E-1225 100°C 0.26

Outgassing

Total Mass Loss (%)

Collected Volatile

Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±)

NASA SP-R-0022A

Maximum 1.00%

Maximum 0.10%

125°C, ≤ 10-6 torr

 

0.01

0.01

0.00

NO

Flammability UL 94 Vertical Burn IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0

 

High Frequency CuClad233 RF PCB Substrate 1

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