logo
produits
EINZELHEITEN ZU DEN PRODUKTEN
Zu Hause > Produits >
Rogers RT duroid5870 Copper Clad Laminate Sheet

Rogers RT duroid5870 Copper Clad Laminate Sheet

MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Werktage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Stück pro Monat
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-332.V1.0
Teilenummer:
Rogers RT Duroid 5870
Laminatstärke:
0,127 mm 0,254 mm 0,381 mm 0,508 mm 0,787 mm 1,575 mm 3,175 mm
Laminatgröße:
18 x 12 Zoll (457 x 305 mm); 18 x 24 Zoll (457 x 610 mm)
Kupfergewicht:
0,5 Unzen (0,018 mm), 1 Unze (0,035 mm)
Hervorheben:

Rogers RT duroid5870 laminate sheet

,

copper clad laminate with warranty

,

RT duroid5870 high frequency laminate

Produktbeschreibung

RT/duroid 5870 is a glass microfiber-reinforced PTFE composite engineered specifically for high-precision stripline and microstrip circuit implementations.


The material’s randomly oriented microfiber architecture delivers exceptional dielectric constant (Dk) uniformity—a characteristic that ensures consistent Dk values not only across individual panels, but also over a broad operating frequency spectrum. Combined with its inherently low dissipation factor (Df), this attribute extends the material’s applicability to Ku-band and higher-frequency systems.


RT/duroid 5870 laminates exhibit outstanding machinability, enabling straightforward cutting, shearing, and precision shaping. Furthermore, the composite demonstrates robust resistance to all solvents and chemical reagents—whether hot or cold—commonly utilized in printed circuit etching, as well as edge and through-hole plating processes.


As a standard offering, RT/duroid 5870 is supplied as double-sided copper-clad laminates, featuring electrodeposited copper (EDC) with a thickness range of ½–2 oz/ft² (8–70 µm) or reverse-treated EDC variants. For applications demanding more stringent electrical performance, the composite can also be clad with rolled copper foil. Custom cladding options, including aluminum, copper, or brass plate, are available upon specification.


Critical Notes for Ordering: To ensure accurate fulfillment, orders for RT/duroid 5870 laminates must clearly specify the following parameters: dielectric thickness and corresponding tolerance, copper foil type (rolled, electrodeposited, or reverse-treated EDC), and required copper foil weight.

 

Rogers RT duroid5870 Copper Clad Laminate Sheet 0


Key Features

  • Industry-leading low electrical loss among reinforced PTFE materials
  • Minimal moisture absorption
  • Isotropic material characteristics
  • Consistent electrical performance across a broad frequency range
  • Superior chemical resistance


Typical Applications

  • Commercial aviation broadband antennas
  • Microstrip and stripline circuits
  • Millimeter-wave systems
  • Military radar systems
  • Missile guidance systems
  • Point-to-point digital radio antennas

 

RT/duroid 5870 Typical Value
Property RT/duroid 5870 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.33
2.33±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.33 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0005
0.0012
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -115 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1300(189) 490(71) X
1280(185) 430(63) Y
Ultimate Stress 50(7.3) 34(4.8) X
42(6.1) 34(4.8) Y
Ultimate Strain 9.8 8.7 X %
9.8 8.6 Y
Compressive Modulus 1210(176) 680(99) X MPa(kpsi) A ASTM D 695
1360(198) 860(125) Y
803(120) 520(76) Z
Ultimate Stress 30(4.4) 23(3.4) X
37(5.3) 25(3.7) Y
54(7.8) 37(5.3) Z
Ultimate Strain 4 4.3 X %
3.3 3.3 Y
8.7 8.5 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.22 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 22
28
173
X
Y
Z
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 27.2(4.8) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

 

Rogers RT duroid5870 Copper Clad Laminate Sheet 1

produits
EINZELHEITEN ZU DEN PRODUKTEN
Rogers RT duroid5870 Copper Clad Laminate Sheet
MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Werktage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Stück pro Monat
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-332.V1.0
Teilenummer:
Rogers RT Duroid 5870
Laminatstärke:
0,127 mm 0,254 mm 0,381 mm 0,508 mm 0,787 mm 1,575 mm 3,175 mm
Laminatgröße:
18 x 12 Zoll (457 x 305 mm); 18 x 24 Zoll (457 x 610 mm)
Kupfergewicht:
0,5 Unzen (0,018 mm), 1 Unze (0,035 mm)
Min Bestellmenge:
1Stk
Preis:
USD9.99-99.99
Verpackung Informationen:
Vakuumbeutel+Kartons
Lieferzeit:
8-9 Werktage
Zahlungsbedingungen:
T/T
Versorgungsmaterial-Fähigkeit:
5000 Stück pro Monat
Hervorheben

Rogers RT duroid5870 laminate sheet

,

copper clad laminate with warranty

,

RT duroid5870 high frequency laminate

Produktbeschreibung

RT/duroid 5870 is a glass microfiber-reinforced PTFE composite engineered specifically for high-precision stripline and microstrip circuit implementations.


The material’s randomly oriented microfiber architecture delivers exceptional dielectric constant (Dk) uniformity—a characteristic that ensures consistent Dk values not only across individual panels, but also over a broad operating frequency spectrum. Combined with its inherently low dissipation factor (Df), this attribute extends the material’s applicability to Ku-band and higher-frequency systems.


RT/duroid 5870 laminates exhibit outstanding machinability, enabling straightforward cutting, shearing, and precision shaping. Furthermore, the composite demonstrates robust resistance to all solvents and chemical reagents—whether hot or cold—commonly utilized in printed circuit etching, as well as edge and through-hole plating processes.


As a standard offering, RT/duroid 5870 is supplied as double-sided copper-clad laminates, featuring electrodeposited copper (EDC) with a thickness range of ½–2 oz/ft² (8–70 µm) or reverse-treated EDC variants. For applications demanding more stringent electrical performance, the composite can also be clad with rolled copper foil. Custom cladding options, including aluminum, copper, or brass plate, are available upon specification.


Critical Notes for Ordering: To ensure accurate fulfillment, orders for RT/duroid 5870 laminates must clearly specify the following parameters: dielectric thickness and corresponding tolerance, copper foil type (rolled, electrodeposited, or reverse-treated EDC), and required copper foil weight.

 

Rogers RT duroid5870 Copper Clad Laminate Sheet 0


Key Features

  • Industry-leading low electrical loss among reinforced PTFE materials
  • Minimal moisture absorption
  • Isotropic material characteristics
  • Consistent electrical performance across a broad frequency range
  • Superior chemical resistance


Typical Applications

  • Commercial aviation broadband antennas
  • Microstrip and stripline circuits
  • Millimeter-wave systems
  • Military radar systems
  • Missile guidance systems
  • Point-to-point digital radio antennas

 

RT/duroid 5870 Typical Value
Property RT/duroid 5870 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.33
2.33±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.33 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0005
0.0012
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -115 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1300(189) 490(71) X
1280(185) 430(63) Y
Ultimate Stress 50(7.3) 34(4.8) X
42(6.1) 34(4.8) Y
Ultimate Strain 9.8 8.7 X %
9.8 8.6 Y
Compressive Modulus 1210(176) 680(99) X MPa(kpsi) A ASTM D 695
1360(198) 860(125) Y
803(120) 520(76) Z
Ultimate Stress 30(4.4) 23(3.4) X
37(5.3) 25(3.7) Y
54(7.8) 37(5.3) Z
Ultimate Strain 4 4.3 X %
3.3 3.3 Y
8.7 8.5 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.22 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 22
28
173
X
Y
Z
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 27.2(4.8) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

 

Rogers RT duroid5870 Copper Clad Laminate Sheet 1

Sitemap |  Datenschutzrichtlinie | China gut Qualität Rf-PWB-Brett Lieferant. Urheberrecht © 2020-2026 Bicheng Electronics Technology Co., Ltd - Alle. Alle Rechte vorbehalten.