| MOQ: | 1Stk |
| Preis: | USD9.99-99.99 |
| Standardverpackung: | Vakuumbeutel+Kartons |
| Lieferfrist: | 8-9 Werktage |
| Zahlungsmethode: | T/T |
| Lieferkapazität: | 5000 Stück pro Monat |
RT/duroid 5870 is a glass microfiber-reinforced PTFE composite engineered specifically for high-precision stripline and microstrip circuit implementations.
The material’s randomly oriented microfiber architecture delivers exceptional dielectric constant (Dk) uniformity—a characteristic that ensures consistent Dk values not only across individual panels, but also over a broad operating frequency spectrum. Combined with its inherently low dissipation factor (Df), this attribute extends the material’s applicability to Ku-band and higher-frequency systems.
RT/duroid 5870 laminates exhibit outstanding machinability, enabling straightforward cutting, shearing, and precision shaping. Furthermore, the composite demonstrates robust resistance to all solvents and chemical reagents—whether hot or cold—commonly utilized in printed circuit etching, as well as edge and through-hole plating processes.
As a standard offering, RT/duroid 5870 is supplied as double-sided copper-clad laminates, featuring electrodeposited copper (EDC) with a thickness range of ½–2 oz/ft² (8–70 µm) or reverse-treated EDC variants. For applications demanding more stringent electrical performance, the composite can also be clad with rolled copper foil. Custom cladding options, including aluminum, copper, or brass plate, are available upon specification.
Critical Notes for Ordering: To ensure accurate fulfillment, orders for RT/duroid 5870 laminates must clearly specify the following parameters: dielectric thickness and corresponding tolerance, copper foil type (rolled, electrodeposited, or reverse-treated EDC), and required copper foil weight.
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Key Features
Typical Applications
| RT/duroid 5870 Typical Value | ||||||
| Property | RT/duroid 5870 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.33 2.33±0.02 spec. |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Dielectric Constant,εDesign | 2.33 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0005 0.0012 |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Thermal Coefficient of ε | -115 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) |
N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1300(189) | 490(71) | X | ||||
| 1280(185) | 430(63) | Y | ||||
| Ultimate Stress | 50(7.3) | 34(4.8) | X | |||
| 42(6.1) | 34(4.8) | Y | ||||
| Ultimate Strain | 9.8 | 8.7 | X | % | ||
| 9.8 | 8.6 | Y | ||||
| Compressive Modulus | 1210(176) | 680(99) | X | MPa(kpsi) | A | ASTM D 695 |
| 1360(198) | 860(125) | Y | ||||
| 803(120) | 520(76) | Z | ||||
| Ultimate Stress | 30(4.4) | 23(3.4) | X | |||
| 37(5.3) | 25(3.7) | Y | ||||
| 54(7.8) | 37(5.3) | Z | ||||
| Ultimate Strain | 4 | 4.3 | X | % | ||
| 3.3 | 3.3 | Y | ||||
| 8.7 | 8.5 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.22 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 22 28 173 |
X Y Z |
ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 27.2(4.8) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float |
IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
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| MOQ: | 1Stk |
| Preis: | USD9.99-99.99 |
| Standardverpackung: | Vakuumbeutel+Kartons |
| Lieferfrist: | 8-9 Werktage |
| Zahlungsmethode: | T/T |
| Lieferkapazität: | 5000 Stück pro Monat |
RT/duroid 5870 is a glass microfiber-reinforced PTFE composite engineered specifically for high-precision stripline and microstrip circuit implementations.
The material’s randomly oriented microfiber architecture delivers exceptional dielectric constant (Dk) uniformity—a characteristic that ensures consistent Dk values not only across individual panels, but also over a broad operating frequency spectrum. Combined with its inherently low dissipation factor (Df), this attribute extends the material’s applicability to Ku-band and higher-frequency systems.
RT/duroid 5870 laminates exhibit outstanding machinability, enabling straightforward cutting, shearing, and precision shaping. Furthermore, the composite demonstrates robust resistance to all solvents and chemical reagents—whether hot or cold—commonly utilized in printed circuit etching, as well as edge and through-hole plating processes.
As a standard offering, RT/duroid 5870 is supplied as double-sided copper-clad laminates, featuring electrodeposited copper (EDC) with a thickness range of ½–2 oz/ft² (8–70 µm) or reverse-treated EDC variants. For applications demanding more stringent electrical performance, the composite can also be clad with rolled copper foil. Custom cladding options, including aluminum, copper, or brass plate, are available upon specification.
Critical Notes for Ordering: To ensure accurate fulfillment, orders for RT/duroid 5870 laminates must clearly specify the following parameters: dielectric thickness and corresponding tolerance, copper foil type (rolled, electrodeposited, or reverse-treated EDC), and required copper foil weight.
![]()
Key Features
Typical Applications
| RT/duroid 5870 Typical Value | ||||||
| Property | RT/duroid 5870 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.33 2.33±0.02 spec. |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Dielectric Constant,εDesign | 2.33 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0005 0.0012 |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Thermal Coefficient of ε | -115 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) |
N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1300(189) | 490(71) | X | ||||
| 1280(185) | 430(63) | Y | ||||
| Ultimate Stress | 50(7.3) | 34(4.8) | X | |||
| 42(6.1) | 34(4.8) | Y | ||||
| Ultimate Strain | 9.8 | 8.7 | X | % | ||
| 9.8 | 8.6 | Y | ||||
| Compressive Modulus | 1210(176) | 680(99) | X | MPa(kpsi) | A | ASTM D 695 |
| 1360(198) | 860(125) | Y | ||||
| 803(120) | 520(76) | Z | ||||
| Ultimate Stress | 30(4.4) | 23(3.4) | X | |||
| 37(5.3) | 25(3.7) | Y | ||||
| 54(7.8) | 37(5.3) | Z | ||||
| Ultimate Strain | 4 | 4.3 | X | % | ||
| 3.3 | 3.3 | Y | ||||
| 8.7 | 8.5 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.22 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 22 28 173 |
X Y Z |
ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 27.2(4.8) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float |
IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
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