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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

MOQ:	1Stk
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Werktage
Zahlungsmethode:	T/T
Lieferkapazität:	5000 Stück pro Monat

Einzelheiten Informationen

Produktbeschreibung

Einzelheiten

Herkunftsort

China

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-332.V1.0

Teilenummer:

TLY-3

Laminatstärke:

0,0035 Zoll; 0,0050 Zoll; 0,0075 Zoll; 0,0100 Zoll

Laminatgröße:

12 x 18 Zoll (305 x 457 mm); 16 x 36 Zoll (406 x 914 mm); 16 x 18 Zoll (406 x 457 mm); 24 x 36 Zoll

Kupfergewicht:

1/2 Unze. ED-Kupfer；1 oz. CL1 Kupfer; 1 Unze. C1 Kupfer

Hervorheben:

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

Produktbeschreibung

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet 0

Properties	Conditions	Typical Value	Unit	Test Method
Electrical Properties	Dielectric Constant @ 10 GHz	2.33 ± 0.02	-	IPC-650 2.5.5.5
	Dissipation Factor @ 10 GHz	0.0012	-	IPC-650 2.5.5.5
	Volume Resistivity (after elevated temp.)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Volume Resistivity (after humidity)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Surface Resistivity (after elevated temp.)	10⁸	Mohms	IPC-650 2.5.17.1
	Surface Resistivity (after humidity)	10⁸	Mohms	IPC-650 2.5.17.1
Thermal Properties	Thermal Conductivity	0.22	W/M*K	ASTM F 433
	CTE (25-260°C) - X	26	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Y	15	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Z	217	ppm/°C	ASTM D 3386 (TMA)
Mechanical Properties	Peel Strength - 1/2 oz. ED copper	1.96 (11)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. CL1 copper	2.86 (16)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. C1 copper	3.04 (17)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength (at elevated temp.)	2.32 (13)	N/mm (Ibs/in)	IPC-650 2.4.8
	Flexural Strength - MD	96.91 (14,057)	N/mm² (psi)	IPC-650 2.4.4
	Flexural Strength - CD	89.32 (12,955)	N/mm² (psi)	IPC-650 2.4.4
	Young’s Modulus - MD	9.65 X 10³ (1.4 X 10⁶)	N/mm² (psi)	ASTM D 3039 / IPC-650 2.4.19
	Poisson’s Ratio - MD	0.21	-	ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties	Density Specific Gravity	2.19	g/cm³	ASTM D 792
Mechanical Properties	Dimensional Stability - MD, 10 mil	-0.038	mm/M (mils/in)	IPC-650 2.4.39
Mechanical Properties	Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress)	-0.038	mm/M (mils/in)	-
Chemical / Physical Properties	Moisture Absorption	0.02	%	IPC-650 2.6.2.1
	NASA Outgassing - TML	0.01	%	-
	NASA Outgassing - CVCM	0.01	%	-
	NASA Outgassing - WVR	0.01	%	-
	UL-94 Flammability Rating	V-0	-	UL-94

Key Benefits

Excellent dimensional stability
Ultra-low dissipation factor (Df)
High peel strength
Low moisture absorption
Consistent, uniform dielectric constant (Dk)
Laser-ablatable

Target Applications

Automotive radar
Satellite and cellular communications
Power amplifiers
LNBs, LNAs, and LNCs
Aerospace systems
Ka-band, E-band, and W-band applications

Tags:

Produits

MOQ:	1Stk
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Werktage
Zahlungsmethode:	T/T
Lieferkapazität:	5000 Stück pro Monat

Einzelheiten

Produktbeschreibung

Einzelheiten

Herkunftsort

China

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-332.V1.0

Teilenummer:

TLY-3

Laminatstärke:

0,0035 Zoll; 0,0050 Zoll; 0,0075 Zoll; 0,0100 Zoll

Laminatgröße:

12 x 18 Zoll (305 x 457 mm); 16 x 36 Zoll (406 x 914 mm); 16 x 18 Zoll (406 x 457 mm); 24 x 36 Zoll

Kupfergewicht:

1/2 Unze. ED-Kupfer；1 oz. CL1 Kupfer; 1 Unze. C1 Kupfer

Min Bestellmenge:

1Stk

Preis:

USD9.99-99.99

Verpackung Informationen:

Vakuumbeutel+Kartons

Lieferzeit:

8-9 Werktage

Zahlungsbedingungen:

T/T

Versorgungsmaterial-Fähigkeit:

5000 Stück pro Monat

Hervorheben

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

Produktbeschreibung

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet 0

Properties	Conditions	Typical Value	Unit	Test Method
Electrical Properties	Dielectric Constant @ 10 GHz	2.33 ± 0.02	-	IPC-650 2.5.5.5
	Dissipation Factor @ 10 GHz	0.0012	-	IPC-650 2.5.5.5
	Volume Resistivity (after elevated temp.)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Volume Resistivity (after humidity)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Surface Resistivity (after elevated temp.)	10⁸	Mohms	IPC-650 2.5.17.1
	Surface Resistivity (after humidity)	10⁸	Mohms	IPC-650 2.5.17.1
Thermal Properties	Thermal Conductivity	0.22	W/M*K	ASTM F 433
	CTE (25-260°C) - X	26	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Y	15	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Z	217	ppm/°C	ASTM D 3386 (TMA)
Mechanical Properties	Peel Strength - 1/2 oz. ED copper	1.96 (11)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. CL1 copper	2.86 (16)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. C1 copper	3.04 (17)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength (at elevated temp.)	2.32 (13)	N/mm (Ibs/in)	IPC-650 2.4.8
	Flexural Strength - MD	96.91 (14,057)	N/mm² (psi)	IPC-650 2.4.4
	Flexural Strength - CD	89.32 (12,955)	N/mm² (psi)	IPC-650 2.4.4
	Young’s Modulus - MD	9.65 X 10³ (1.4 X 10⁶)	N/mm² (psi)	ASTM D 3039 / IPC-650 2.4.19
	Poisson’s Ratio - MD	0.21	-	ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties	Density Specific Gravity	2.19	g/cm³	ASTM D 792
Mechanical Properties	Dimensional Stability - MD, 10 mil	-0.038	mm/M (mils/in)	IPC-650 2.4.39
Mechanical Properties	Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress)	-0.038	mm/M (mils/in)	-
Chemical / Physical Properties	Moisture Absorption	0.02	%	IPC-650 2.6.2.1
	NASA Outgassing - TML	0.01	%	-
	NASA Outgassing - CVCM	0.01	%	-
	NASA Outgassing - WVR	0.01	%	-
	UL-94 Flammability Rating	V-0	-	UL-94

Key Benefits

Excellent dimensional stability
Ultra-low dissipation factor (Df)
High peel strength
Low moisture absorption
Consistent, uniform dielectric constant (Dk)
Laser-ablatable

Target Applications

Automotive radar
Satellite and cellular communications
Power amplifiers
LNBs, LNAs, and LNCs
Aerospace systems
Ka-band, E-band, and W-band applications

Tags:

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

Brett PWB-fr4

PWB-Schablone

Metallkern PWB

Kupferplattierte Laminate

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

0.1 mm Kupferplattiertes Laminat,

BME217 Kupferplattiertes Laminat,

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

Brett PWB-fr4

PWB-Schablone

Metallkern PWB

Kupferplattierte Laminate

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

0.1 mm Kupferplattiertes Laminat,

BME217 Kupferplattiertes Laminat,