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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
  • Name

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Arbeitstage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Prozent pro Monat
Einzelheiten Informationen
Produktbeschreibung
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-332.V1.0
Grundmaterial:
Rogers RO4360G2
Schichtzahl:
2 Schichten
Dicke der Leiterplatte:
0,9 mm
PCB-Größe:
73,12 mm x 44,71 mm pro Stück (1 Stück),
Seidenbildschirm:
Weiß
Lötmaske:
Grün
Kupfergewicht:
1oz (1,4 mil) für die Außenschichten
Oberflächenbeschaffenheit:
Eintauchen Gold
Hervorheben:

RO4360G2 PCB 2 layer

,

Rogers PCB immersion gold finish

,

32mil substrate PCB board

Produktbeschreibung
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
Leveraging Rogers RO4360G2, a low-loss, glass-reinforced hydrocarbon ceramic thermoset material, this 2-layer rigid PCB is purpose-built for high-frequency telecom applications—specifically base station power amplifiers and small cell transceivers.
PCB Specification
Parameter Details
Base Material Rogers RO4360G2 - Low-loss, glass-reinforced hydrocarbon ceramic thermoset; first high-Dk thermoset laminate processable like FR-4
Layer Count 2 layers (rigid structure)
Board Dimensions 73.12mm x 44.71mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 6 mils (space)
Minimum Hole Size 0.30mm
Vias No blind vias; via plating thickness = 20 μm - Ensures low
Finished Board Thickness 0.9mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing prior shipment
PCB Stack-up
The stack-up is engineered to maximize RF performance and thermal reliability, leveraging RO4360G2's high Dk and copper-matched thermal expansion:
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4360G2 0.813mm (32mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish 0
Rogers RO4360G2 Material Introduction
Rogers RO4360G2 redefines high-Dk telecom material design by solving a key industry challenge: high performance without specialized processing. As the first high-Dk thermoset laminate processable like standard FR-4, it eliminates the need for costly, time-consuming fabrication steps (e.g., sodium etch for PTFE materials) while delivering the RF properties required for power amplifiers and transceivers.
  • Glass Reinforcement: Adds rigidity for easier handling in multi-layer constructions (and compatible with RO440 series prepreg/RO4000 low-Dk laminates for complex designs)
  • Lead-Free Compatibility: Aligns with global environmental regulations (e.g., RoHS) for telecom equipment
  • Cost Efficiency: Short lead times and efficient supply chains reduce material and production costs—critical for large-scale base station rollouts
Key Material Features
Feature Specification
Dielectric Constant (Dk) 6.15 ± 0.15 at 10GHz/23°C
Dissipation Factor (DF) 0.0038 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >407°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.75 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 13 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 28 ppm/°C (-55 to 288°C)
Flammability Rating UL 94 V-0
Process Compatibility Lead-free process compatible; FR-4-like fabrication
Core Benefits
  • High RF Efficiency: High Dk (6.15) enables compact RF circuit designs (critical for small cell transceivers) while low DF (0.0038) minimizes signal loss in power amplifiers
  • Plated Through-Hole (PTH) Reliability: Low Z-axis CTE (28 ppm/°C) and copper-matched X/Y CTE prevent PTH cracking during thermal cycling.
  • Automated Assembly Compatibility: FR-4-like processing works with standard SMT and thru-hole assembly lines, reducing production time for high-volume telecom orders.
  • Thermal Resilience: High Tg (>280°C) and Td (>407°C) withstand lead-free soldering and the heat generated by power amplifiers, preventing component failure.
  • Environmental Compliance: Lead-free and UL 94 V-0 rated, meeting global telecom safety and sustainability standards.
Some Typical Applications
  • Base Station Power Amplifiers
  • Small Cell Transceivers
The 2-layer PCB with Rogers RO4360G2 material is a telecom-optimized solution that bridges high performance and practicality.
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish 1
Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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produits
EINZELHEITEN ZU DEN PRODUKTEN
Produits

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

Brett PWB-fr4

PWB-Schablone

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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
  • Name
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Arbeitstage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Prozent pro Monat
Einzelheiten
Produktbeschreibung
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-332.V1.0
Grundmaterial:
Rogers RO4360G2
Schichtzahl:
2 Schichten
Dicke der Leiterplatte:
0,9 mm
PCB-Größe:
73,12 mm x 44,71 mm pro Stück (1 Stück),
Seidenbildschirm:
Weiß
Lötmaske:
Grün
Kupfergewicht:
1oz (1,4 mil) für die Außenschichten
Oberflächenbeschaffenheit:
Eintauchen Gold
Min Bestellmenge:
1Stk
Preis:
USD9.99-99.99
Verpackung Informationen:
Vakuumbeutel+Kartons
Lieferzeit:
8-9 Arbeitstage
Zahlungsbedingungen:
T/T
Versorgungsmaterial-Fähigkeit:
5000 Prozent pro Monat
Hervorheben

RO4360G2 PCB 2 layer

,

Rogers PCB immersion gold finish

,

32mil substrate PCB board

Produktbeschreibung
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
Leveraging Rogers RO4360G2, a low-loss, glass-reinforced hydrocarbon ceramic thermoset material, this 2-layer rigid PCB is purpose-built for high-frequency telecom applications—specifically base station power amplifiers and small cell transceivers.
PCB Specification
Parameter Details
Base Material Rogers RO4360G2 - Low-loss, glass-reinforced hydrocarbon ceramic thermoset; first high-Dk thermoset laminate processable like FR-4
Layer Count 2 layers (rigid structure)
Board Dimensions 73.12mm x 44.71mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 6 mils (space)
Minimum Hole Size 0.30mm
Vias No blind vias; via plating thickness = 20 μm - Ensures low
Finished Board Thickness 0.9mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing prior shipment
PCB Stack-up
The stack-up is engineered to maximize RF performance and thermal reliability, leveraging RO4360G2's high Dk and copper-matched thermal expansion:
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4360G2 0.813mm (32mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish 0
Rogers RO4360G2 Material Introduction
Rogers RO4360G2 redefines high-Dk telecom material design by solving a key industry challenge: high performance without specialized processing. As the first high-Dk thermoset laminate processable like standard FR-4, it eliminates the need for costly, time-consuming fabrication steps (e.g., sodium etch for PTFE materials) while delivering the RF properties required for power amplifiers and transceivers.
  • Glass Reinforcement: Adds rigidity for easier handling in multi-layer constructions (and compatible with RO440 series prepreg/RO4000 low-Dk laminates for complex designs)
  • Lead-Free Compatibility: Aligns with global environmental regulations (e.g., RoHS) for telecom equipment
  • Cost Efficiency: Short lead times and efficient supply chains reduce material and production costs—critical for large-scale base station rollouts
Key Material Features
Feature Specification
Dielectric Constant (Dk) 6.15 ± 0.15 at 10GHz/23°C
Dissipation Factor (DF) 0.0038 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >407°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.75 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 13 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 28 ppm/°C (-55 to 288°C)
Flammability Rating UL 94 V-0
Process Compatibility Lead-free process compatible; FR-4-like fabrication
Core Benefits
  • High RF Efficiency: High Dk (6.15) enables compact RF circuit designs (critical for small cell transceivers) while low DF (0.0038) minimizes signal loss in power amplifiers
  • Plated Through-Hole (PTH) Reliability: Low Z-axis CTE (28 ppm/°C) and copper-matched X/Y CTE prevent PTH cracking during thermal cycling.
  • Automated Assembly Compatibility: FR-4-like processing works with standard SMT and thru-hole assembly lines, reducing production time for high-volume telecom orders.
  • Thermal Resilience: High Tg (>280°C) and Td (>407°C) withstand lead-free soldering and the heat generated by power amplifiers, preventing component failure.
  • Environmental Compliance: Lead-free and UL 94 V-0 rated, meeting global telecom safety and sustainability standards.
Some Typical Applications
  • Base Station Power Amplifiers
  • Small Cell Transceivers
The 2-layer PCB with Rogers RO4360G2 material is a telecom-optimized solution that bridges high performance and practicality.
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish 1
Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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