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LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
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LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
  • Name

LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish

MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Arbeitstage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Prozent pro Monat
Einzelheiten Informationen
Produktbeschreibung
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-332.V1.0
Grundmaterial:
Rogers RO4350B Low Profile (LoPro)
Schichtzahl:
2 Schichten
Dicke der Leiterplatte:
1,6 mm
PCB-Größe:
43 mm x 56 mm pro Stück (1 Stück)
Seidenbildschirm:
Weiß
Lötmaske:
Grün
Kupfergewicht:
1oz (1,4 mil) für die Außenschichten
Oberflächenbeschaffenheit:
ENEPIG (Elektroloses Nickel, stromloses Palladium und Immersionsgold)
Hervorheben:

LoPro RO4350B PCB board

,

Double-sided Rogers PCB 1.6mm

,

ENEPIG finish PCB board

Produktbeschreibung
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
This 2-layer rigid PCB is engineered for high-frequency RF and high-speed digital applications, leveraging Rogers RO4350B Low Profile (LoPro) material--a hydrocarbon ceramic laminate with proprietary reverse-treated foil technology. To achieve superior signal integrity, reduced conductor loss, and cost-efficient manufacturing, it balances performance and practicality for use cases ranging from cellular base stations to high-speed servers.
PCB Specification
Parameter Details
Base Material Rogers RO4350B Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 43mm x 56mm per piece (1PCS)
Minimum Trace/Space 4 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing before shipment
PCB Stack-up
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4350B LoPro 1.542mm (60.7mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
Rogers RO4350B Low Profile Material
Rogers RO4350B LoPro redefines cost-effective high-frequency design with its proprietary reverse-treated foil technology. This innovation bonds foil directly to standard RO4350B dielectric, delivering reduced conductor loss (and thus improved insertion loss) while retaining all key benefits of standard RO4350B:
FR-4 Process Compatibility: No specialized via preparation (e.g., sodium etch) required - uses standard epoxy/glass fabrication workflows to lower manufacturing costs and lead times.
Hydrocarbon Ceramic Composition: Combines low dielectric loss with mechanical stability, making it ideal for mixed-signal (RF + digital) applications.
Environmental Compliance: Lead-free process compatible and UL 94-V0 rated, meeting global safety and sustainability standards.
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 0
Key Material Features
Feature Specification
Dielectric Constant (Dk) 3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0037 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >390°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.69 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 10 ppm/°C
- Y-axis: 12 ppm/°C
- Z-axis: 32 ppm/°C (-55 to 288°C)
Flammability Rating UL 94-V0
Additional Attributes CAF (Conductive Anodic Filament) resistant; lead-free compatible
Core Benefits
  • Ultra-Low Insertion Loss: Enables reliable operation beyond 40 GHz - critical for high-frequency applications like LNBs and base station antennas.
  • Reduced PIM: Minimizes passive intermodulation for clear signal transmission in cellular infrastructure, avoiding call drops or data degradation.
  • Thermal Resilience: Lower conductor loss improves heat dissipation, while high Tg/Td withstands lead-free soldering and high-temperature operating environments (e.g., server racks, outdoor antennas).
  • Copper-Matched CTE: X/Y-axis CTE (10/12 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling - ensuring long-term reliability.
  • Design Flexibility: Supports multi-layer scalability (for future complex designs) and 2-layer cost-effectiveness, with CAF resistance for durability in humid environments.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 1
Summary
The 2-layer PCB with Rogers RO4350B Low Profile material is a versatile, high-performance solution for RF and high-speed digital applications. By combining low conductor loss, FR-4 compatibility, ENEPIG finish, and industry-leading reliability, it addresses the key challenges of modern electronics - from signal integrity at 40+ GHz to cost-effective volume manufacturing. Its global availability and compliance with IPC-Class-2 standards make it a trusted choice for telecom, data center, satellite, and RFID projects worldwide.
Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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produits
EINZELHEITEN ZU DEN PRODUKTEN
Produits

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

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LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
  • Name
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Arbeitstage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Prozent pro Monat
Einzelheiten
Produktbeschreibung
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-332.V1.0
Grundmaterial:
Rogers RO4350B Low Profile (LoPro)
Schichtzahl:
2 Schichten
Dicke der Leiterplatte:
1,6 mm
PCB-Größe:
43 mm x 56 mm pro Stück (1 Stück)
Seidenbildschirm:
Weiß
Lötmaske:
Grün
Kupfergewicht:
1oz (1,4 mil) für die Außenschichten
Oberflächenbeschaffenheit:
ENEPIG (Elektroloses Nickel, stromloses Palladium und Immersionsgold)
Min Bestellmenge:
1Stk
Preis:
USD9.99-99.99
Verpackung Informationen:
Vakuumbeutel+Kartons
Lieferzeit:
8-9 Arbeitstage
Zahlungsbedingungen:
T/T
Versorgungsmaterial-Fähigkeit:
5000 Prozent pro Monat
Hervorheben

LoPro RO4350B PCB board

,

Double-sided Rogers PCB 1.6mm

,

ENEPIG finish PCB board

Produktbeschreibung
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
This 2-layer rigid PCB is engineered for high-frequency RF and high-speed digital applications, leveraging Rogers RO4350B Low Profile (LoPro) material--a hydrocarbon ceramic laminate with proprietary reverse-treated foil technology. To achieve superior signal integrity, reduced conductor loss, and cost-efficient manufacturing, it balances performance and practicality for use cases ranging from cellular base stations to high-speed servers.
PCB Specification
Parameter Details
Base Material Rogers RO4350B Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 43mm x 56mm per piece (1PCS)
Minimum Trace/Space 4 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing before shipment
PCB Stack-up
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4350B LoPro 1.542mm (60.7mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
Rogers RO4350B Low Profile Material
Rogers RO4350B LoPro redefines cost-effective high-frequency design with its proprietary reverse-treated foil technology. This innovation bonds foil directly to standard RO4350B dielectric, delivering reduced conductor loss (and thus improved insertion loss) while retaining all key benefits of standard RO4350B:
FR-4 Process Compatibility: No specialized via preparation (e.g., sodium etch) required - uses standard epoxy/glass fabrication workflows to lower manufacturing costs and lead times.
Hydrocarbon Ceramic Composition: Combines low dielectric loss with mechanical stability, making it ideal for mixed-signal (RF + digital) applications.
Environmental Compliance: Lead-free process compatible and UL 94-V0 rated, meeting global safety and sustainability standards.
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 0
Key Material Features
Feature Specification
Dielectric Constant (Dk) 3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0037 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >390°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.69 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 10 ppm/°C
- Y-axis: 12 ppm/°C
- Z-axis: 32 ppm/°C (-55 to 288°C)
Flammability Rating UL 94-V0
Additional Attributes CAF (Conductive Anodic Filament) resistant; lead-free compatible
Core Benefits
  • Ultra-Low Insertion Loss: Enables reliable operation beyond 40 GHz - critical for high-frequency applications like LNBs and base station antennas.
  • Reduced PIM: Minimizes passive intermodulation for clear signal transmission in cellular infrastructure, avoiding call drops or data degradation.
  • Thermal Resilience: Lower conductor loss improves heat dissipation, while high Tg/Td withstands lead-free soldering and high-temperature operating environments (e.g., server racks, outdoor antennas).
  • Copper-Matched CTE: X/Y-axis CTE (10/12 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling - ensuring long-term reliability.
  • Design Flexibility: Supports multi-layer scalability (for future complex designs) and 2-layer cost-effectiveness, with CAF resistance for durability in humid environments.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 1
Summary
The 2-layer PCB with Rogers RO4350B Low Profile material is a versatile, high-performance solution for RF and high-speed digital applications. By combining low conductor loss, FR-4 compatibility, ENEPIG finish, and industry-leading reliability, it addresses the key challenges of modern electronics - from signal integrity at 40+ GHz to cost-effective volume manufacturing. Its global availability and compliance with IPC-Class-2 standards make it a trusted choice for telecom, data center, satellite, and RFID projects worldwide.
Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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