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12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

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Metallkern PWB

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Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

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12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

MOQ:	1Stk
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Arbeitstage
Zahlungsmethode:	T/T
Lieferkapazität:	5000 Prozent pro Monat

Einzelheiten Informationen

Produktbeschreibung

Einzelheiten

Herkunftsort

China

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-332.V1.0

Grundmaterial:

Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)

Schichtzahl:

12 Schichten

Dicke der Leiterplatte:

2.12mm

PCB-Größe:

220 mm x 60 mm pro Einheit (Toleranz: ±0,15 mm)

Seidenbildschirm:

Lötmaske:

Kupfergewicht:

Äußere Schichten (L1, L12): 1 oz (1,4 mil / 35 μm) Innere Schichten: 0,5 oz (0,7 mil / 17 μm) oder 1

Oberflächenbeschaffenheit:

Elektrololes Nickel -Eintauchgold (Enig)

Hervorheben:

12-layer M6 PCB with ENIG

impedance control multilayer circuit board

high speed PCB with warranty

Produktbeschreibung

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

This 12-layer rigid PCB is engineered with Panasonic Megtron6 (M6) R-5775--an advanced high-speed, low-loss copper-clad laminate (CCL)--to deliver exceptional signal integrity and reliability for demanding high-frequency applications.

PCB Details

Parameter	Specification
Layer Count	12-layer rigid PCB
Base Material	Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)
Board Dimensions	220mm x 60mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	2.12mm
Copper Weight	Outer Layers (L1, L12): 1oz (1.4 mils / 35μm) Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up)
Via Plating Thickness	25μm
Minimum Trace/Space	3 mils / 3 mils
Minimum Hole Size	0.2mm
Vias	459 total (no blind vias); 0.2mm & 0.4mm vias filled with resin + capped plating
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Silkscreen	Top (L1): White; Bottom (L12): White
Solder Mask	Top (L1): Blue; Bottom (L12): Blue
Quality Assurance	100% Electrical test prior to shipment
Artwork Format	Gerber RS-274-X
Quality Standard	IPC-Class-3

Precise PCB Stack-up

Layer Type	Specification	Thickness
Copper Layer (Outer Top - L1)	Copper_layer_1	35μm (1oz)
Prepreg	R-5670(G) 1080 (68%) × 1	81.4μm
Copper Layer (Inner - L2)	Copper_layer_2	35μm (1oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L3)	Copper_layer_3	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	219.9μm
Copper Layer (Inner - L4)	Copper_layer_4	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L5)	Copper_layer_5	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	216.5μm
Copper Layer (Inner - L6)	Copper_layer_6	35μm (1oz)
Megtron6 Core	M6 Core R5775G(HVLP)	400μm (thick core for stability)
Copper Layer (Inner - L7)	Copper_layer_7	35μm (1oz)
Prepreg	R-5670(G) 3313 (59%) × 2	215.6μm
Copper Layer (Inner - L8)	Copper_layer_8	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L9)	Copper_layer_9	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	219.8μm
Copper Layer (Inner - L10)	Copper_layer_10	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L11)	Copper_layer_11	35μm (1oz)
Prepreg	R-5670(G) 1080 (68%) × 1	81.4μm
Copper Layer (Outer Bottom - L12)	Copper_layer_12	35μm (1oz)

Critical Impedance Control (50 Ohm Single-Ended)

Impedance ID	Configuration	Layer	Trace Width	Reference Layers	Target Impedance
Impedance-1	Single-Ended	L1 (Top Outer)	5.71 mils	Down: L2	50 Ohms
Impedance-2	Single-Ended	L3 (Inner)	4.31 mils	Upper: L2; Down: L4	50 Ohms
Impedance-3	Single-Ended	L5 (Inner)	4.71 mils	Upper: L4; Down: L7	50 Ohms
Impedance-4	Single-Ended	L8 (Inner)	4.51 mils	Upper: L7; Down: L9	50 Ohms
Impedance-5	Single-Ended	L10 (Inner)	4.31 mils	Upper: L9; Down: L11	50 Ohms

Megtron6 (M6) R-5775 Material Overview

Panasonic Megtron6 (M6) R-5775 is a premium multilayer copper-clad laminate (CCL) engineered for high-frequency, high-speed, and high-reliability electronic systems. Designed to address the stringent demands of 5G, millimeter-wave, and high-performance computing (HPC) applications, it combines low dielectric loss (Df), stable dielectric constant (Dk), and exceptional thermal reliability--enabling seamless transmission of high-speed signals with minimal attenuation.

As a halogen-free, RoHS-compliant material, Megtron6 aligns with green manufacturing standards while supporting 4-30 layer PCB designs, making it versatile for complex circuit architectures. Its compatibility with traditional FR-4 processing technology eliminates the need for special equipment, reducing production costs without compromising performance.

Key Features of Megtron6 (M6) R-5775

Property	Specification
Dielectric Constant (Dk)	3.4 (1GHz/23°C); 3.34 (13GHz)
Dissipation Factor (Df)	0.002 (1GHz/23°C); 0.0037 (13GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 16 ppm/°C; Y-axis: 16 ppm/°C; Z-axis: 45 ppm/°C
Glass Transition Temperature (Tg)	>185°C (DSC method); 210°C (DMA method)
Thermal Decomposition Temperature (Td)	410°C (TGA method)
Layer Support	4-30 layer multilayer PCB designs
Environmental Compliance	RoHS-compliant; Halogen-free
Manufacturing Compatibility	Traditional FR-4 processing (no special equipment required)
Flammability Rating	UL 94 V-0

Typical Applications

This 12-layer Megtron6 PCB is tailored for high-performance, high-frequency systems across industries:

5G Communication: Millimeter-wave antennas, AAU (Active Antenna Unit) RF front-ends, and 5G base station hardware.
Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems), and autonomous driving sensors.
Data Centers: High-speed server motherboards, 400G/800G optical module PCBs, and high-bandwidth interconnects.
Aerospace & Defense: Satellite communication systems, high-frequency radar circuits, and avionics.
Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices, and high-performance computing peripherals.

Tags:

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Gold-PWB der Immersions-1oz,

PWB medizinischer Ausrüstung Tg150 FR4

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12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

MOQ:	1Stk
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Arbeitstage
Zahlungsmethode:	T/T
Lieferkapazität:	5000 Prozent pro Monat

Einzelheiten

Produktbeschreibung

Einzelheiten

Herkunftsort

China

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-332.V1.0

Grundmaterial:

Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)

Schichtzahl:

12 Schichten

Dicke der Leiterplatte:

2.12mm

PCB-Größe:

220 mm x 60 mm pro Einheit (Toleranz: ±0,15 mm)

Seidenbildschirm:

Weiß

Lötmaske:

Blau

Kupfergewicht:

Äußere Schichten (L1, L12): 1 oz (1,4 mil / 35 μm) Innere Schichten: 0,5 oz (0,7 mil / 17 μm) oder 1

Oberflächenbeschaffenheit:

Elektrololes Nickel -Eintauchgold (Enig)

Min Bestellmenge:

1Stk

Preis:

USD9.99-99.99

Verpackung Informationen:

Vakuumbeutel+Kartons

Lieferzeit:

8-9 Arbeitstage

Zahlungsbedingungen:

T/T

Versorgungsmaterial-Fähigkeit:

5000 Prozent pro Monat

Hervorheben

12-layer M6 PCB with ENIG

impedance control multilayer circuit board

high speed PCB with warranty

Produktbeschreibung

12-layer M6 PCB Impedance Control ENIG Multilayer Circuit Board

PCB Details

Parameter	Specification
Layer Count	12-layer rigid PCB
Base Material	Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G)
Board Dimensions	220mm x 60mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	2.12mm
Copper Weight	Outer Layers (L1, L12): 1oz (1.4 mils / 35μm) Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up)
Via Plating Thickness	25μm
Minimum Trace/Space	3 mils / 3 mils
Minimum Hole Size	0.2mm
Vias	459 total (no blind vias); 0.2mm & 0.4mm vias filled with resin + capped plating
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Silkscreen	Top (L1): White; Bottom (L12): White
Solder Mask	Top (L1): Blue; Bottom (L12): Blue
Quality Assurance	100% Electrical test prior to shipment
Artwork Format	Gerber RS-274-X
Quality Standard	IPC-Class-3

Precise PCB Stack-up

Layer Type	Specification	Thickness
Copper Layer (Outer Top - L1)	Copper_layer_1	35μm (1oz)
Prepreg	R-5670(G) 1080 (68%) × 1	81.4μm
Copper Layer (Inner - L2)	Copper_layer_2	35μm (1oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L3)	Copper_layer_3	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	219.9μm
Copper Layer (Inner - L4)	Copper_layer_4	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L5)	Copper_layer_5	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	216.5μm
Copper Layer (Inner - L6)	Copper_layer_6	35μm (1oz)
Megtron6 Core	M6 Core R5775G(HVLP)	400μm (thick core for stability)
Copper Layer (Inner - L7)	Copper_layer_7	35μm (1oz)
Prepreg	R-5670(G) 3313 (59%) × 2	215.6μm
Copper Layer (Inner - L8)	Copper_layer_8	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L9)	Copper_layer_9	17μm (0.5oz)
Prepreg	R-5670(G) 3313 (59%) × 2	219.8μm
Copper Layer (Inner - L10)	Copper_layer_10	17μm (0.5oz)
Megtron6 Core	M6 Core R5775G(HVLP)	75μm
Copper Layer (Inner - L11)	Copper_layer_11	35μm (1oz)
Prepreg	R-5670(G) 1080 (68%) × 1	81.4μm
Copper Layer (Outer Bottom - L12)	Copper_layer_12	35μm (1oz)

Critical Impedance Control (50 Ohm Single-Ended)

Impedance ID	Configuration	Layer	Trace Width	Reference Layers	Target Impedance
Impedance-1	Single-Ended	L1 (Top Outer)	5.71 mils	Down: L2	50 Ohms
Impedance-2	Single-Ended	L3 (Inner)	4.31 mils	Upper: L2; Down: L4	50 Ohms
Impedance-3	Single-Ended	L5 (Inner)	4.71 mils	Upper: L4; Down: L7	50 Ohms
Impedance-4	Single-Ended	L8 (Inner)	4.51 mils	Upper: L7; Down: L9	50 Ohms
Impedance-5	Single-Ended	L10 (Inner)	4.31 mils	Upper: L9; Down: L11	50 Ohms

Megtron6 (M6) R-5775 Material Overview

Key Features of Megtron6 (M6) R-5775

Property	Specification
Dielectric Constant (Dk)	3.4 (1GHz/23°C); 3.34 (13GHz)
Dissipation Factor (Df)	0.002 (1GHz/23°C); 0.0037 (13GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 16 ppm/°C; Y-axis: 16 ppm/°C; Z-axis: 45 ppm/°C
Glass Transition Temperature (Tg)	>185°C (DSC method); 210°C (DMA method)
Thermal Decomposition Temperature (Td)	410°C (TGA method)
Layer Support	4-30 layer multilayer PCB designs
Environmental Compliance	RoHS-compliant; Halogen-free
Manufacturing Compatibility	Traditional FR-4 processing (no special equipment required)
Flammability Rating	UL 94 V-0

Typical Applications

This 12-layer Megtron6 PCB is tailored for high-performance, high-frequency systems across industries:

5G Communication: Millimeter-wave antennas, AAU (Active Antenna Unit) RF front-ends, and 5G base station hardware.
Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems), and autonomous driving sensors.
Data Centers: High-speed server motherboards, 400G/800G optical module PCBs, and high-bandwidth interconnects.
Aerospace & Defense: Satellite communication systems, high-frequency radar circuits, and avionics.
Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices, and high-performance computing peripherals.

Tags: