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Produktdetails:
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| Grundmaterial: | Diclad 870 | Schichtzahl: | 2-layer |
|---|---|---|---|
| Dicke der Leiterplatte: | 2,5 mm | PCB -Größe: | 83 mm x 35 mm (1 Stück), +/- 0,15 mm |
| Kupfergewicht: | 1oz (äquivalent zu 1,4 mil oder 35 μm) | Oberflächenbeschaffung: | Eintauchen Gold |
| Hervorheben: | 2-Layer RF PCB Board,35μm Copper Layers PCB,2.5mm Thickness Printed Circuit Board |
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| Construction Detail | Specification |
|---|---|
| Base material | DiClad 870 |
| Layer count | 2-layer |
| Board dimensions | 83mm x 35mm (1 piece), +/- 0.15mm |
| Minimum Trace/Space | 5/9 mils |
| Minimum Hole Size | 0.3mm |
| Finished board thickness | 2.5mm |
| Finished Cu weight | Outer layers: 1 oz (1.4 mils) |
| Via plating thickness | 20 μm |
| Surface finish | Immersion gold |
| Silkscreen | No |
| Solder Mask | No |
| Quality assurance (prior to shipment) | 100% Electrical test |
| Layer/Material | Thickness Specification |
|---|---|
| Copper_layer_1 | 35 μm |
| DiClad 870 Core | 2.362mm (93mil) |
| Copper_layer_2 | 35 μm |
Ansprechpartner: Ms. Ivy Deng
Telefon: 86-755-27374946
Faxen: 86-755-27374848