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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

MOQ:	1Stk
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Arbeitstage
Zahlungsmethode:	T/T
Lieferkapazität:	5000 Prozent pro Monat

Einzelheiten Informationen

Produktbeschreibung

Einzelheiten

Herkunftsort

China

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-332.V1.0

Grundmaterial:

Rogers RO4003C Low Profile (LoPro)

Schichtzahl:

2 Schichten

Dicke der Leiterplatte:

0,65 mm

PCB-Größe:

64 mm x 68,4 mm pro Stück (1 Stück)

Seidenbildschirm:

Lötmaske:

Kupfergewicht:

1oz (1,4 mil) für die Außenschichten

Oberflächenbeschaffenheit:

Silberunterplattierung + Vergoldung

Hervorheben:

Rogers PCB board 20.7mil substrate

Double-sided LoPro RO4003C PCB

Rogers PCB with high-frequency performance

Produktbeschreibung

LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.

PCB Specification

Parameter	Details
Base Material	Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count	2-Layer (rigid structure)
Board Dimensions	64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space	5 mils (trace) / 5 mils (space)
Minimum Hole Size	0.3mm
Vias	No blind vias; via plating thickness = 20 μm
Finished Board Thickness	0.65mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	Silver underplating + Gold plating
Silkscreen	White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask	Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance	100% electrical testing conducted prior to shipment

Rogers RO4003C Low Profile Material Introduction

Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss--while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).

Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It's designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.

RO4003C Low Profile Key Features

Feature	Specification
Material Composition	Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk)	3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF)	0.0027 at 10GHz/23°C
Thermal Performance	- Decomposition Temp (Td): >425°C - Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity	0.64 W/mK
Coefficient of Thermal Expansion (CTE)	- X-axis: 11 ppm/°C - Y-axis: 14 ppm/°C - Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility	Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute	CAF (Conductive Anodic Filament) resistant

Material Benefits

RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:

Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
CAF Resistance: Protects against conductive anodic filament formation.
Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.

Some Typical Applications

Digital applications such as servers, routers, and high speed back planes
Cellular base station antennas and power amplifiers
LNB's for direct broadcast satellites
RF Identification Tags

Tags:

Produits

MOQ:	1Stk
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Arbeitstage
Zahlungsmethode:	T/T
Lieferkapazität:	5000 Prozent pro Monat

Einzelheiten

Produktbeschreibung

Einzelheiten

Herkunftsort

China

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-332.V1.0

Grundmaterial:

Rogers RO4003C Low Profile (LoPro)

Schichtzahl:

2 Schichten

Dicke der Leiterplatte:

0,65 mm

PCB-Größe:

64 mm x 68,4 mm pro Stück (1 Stück)

Seidenbildschirm:

Weiß

Lötmaske:

Grün

Kupfergewicht:

1oz (1,4 mil) für die Außenschichten

Oberflächenbeschaffenheit:

Silberunterplattierung + Vergoldung

Min Bestellmenge:

1Stk

Preis:

USD9.99-99.99

Verpackung Informationen:

Vakuumbeutel+Kartons

Lieferzeit:

8-9 Arbeitstage

Zahlungsbedingungen:

T/T

Versorgungsmaterial-Fähigkeit:

5000 Prozent pro Monat

Hervorheben

Rogers PCB board 20.7mil substrate

Double-sided LoPro RO4003C PCB

Rogers PCB with high-frequency performance

Produktbeschreibung

LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

PCB Specification

Parameter	Details
Base Material	Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count	2-Layer (rigid structure)
Board Dimensions	64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space	5 mils (trace) / 5 mils (space)
Minimum Hole Size	0.3mm
Vias	No blind vias; via plating thickness = 20 μm
Finished Board Thickness	0.65mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	Silver underplating + Gold plating
Silkscreen	White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask	Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance	100% electrical testing conducted prior to shipment

Rogers RO4003C Low Profile Material Introduction

RO4003C Low Profile Key Features

Feature	Specification
Material Composition	Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk)	3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF)	0.0027 at 10GHz/23°C
Thermal Performance	- Decomposition Temp (Td): >425°C - Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity	0.64 W/mK
Coefficient of Thermal Expansion (CTE)	- X-axis: 11 ppm/°C - Y-axis: 14 ppm/°C - Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility	Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute	CAF (Conductive Anodic Filament) resistant

Material Benefits

RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:

Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
CAF Resistance: Protects against conductive anodic filament formation.
Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.

Some Typical Applications

Digital applications such as servers, routers, and high speed back planes
Cellular base station antennas and power amplifiers
LNB's for direct broadcast satellites
RF Identification Tags

Tags:

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

Brett PWB-fr4

PWB-Schablone

Metallkern PWB

LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

Rogers PCB board 20.7mil substrate

Double-sided LoPro RO4003C PCB

Rogers PCB with high-frequency performance

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

Brett PWB-fr4

PWB-Schablone

Metallkern PWB

Rogers PCB board 20.7mil substrate

Double-sided LoPro RO4003C PCB

Rogers PCB with high-frequency performance

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,