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Rogers TMM10i PCB 30mil Substrate 1OZ Copper

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Metallkern PWB

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Ms. Ivy Deng

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86-755-27374847

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Rogers TMM10i PCB 30mil Substrate 1OZ Copper

MOQ:	1pcs
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Arbeitstage
Zahlungsmethode:	T/t
Lieferkapazität:	5000 Prozent pro Monat

Einzelheiten Informationen

Produktbeschreibung

Einzelheiten

Herkunftsort

CHINA

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-052.V1.0

Grundmaterial:

Rogers TMM10i

Schichtzahl:

2-layer

Dicke der Leiterplatte:

0,8 mm

PCB -Größe:

70mm x 75mm

Kupfergewicht:

1oz (äquivalent zu 1,4 mil oder 35 μm)

Oberflächenbeschaffung:

Eintauchen

Hervorheben:

Rogers TMM10i PCB board

30mil substrate PCB

1OZ copper Rogers PCB

Produktbeschreibung

Rogers TMM10i PCB 30mil Substrate 1OZ Copper

This double-sided (2-layer) rigid PCB is built with Rogers TMM10i, an isotropic thermoset microwave composite optimized for high-reliability RF and microwave applications.

1. PCB Specifications

Parameter	Specification
Base Material	Rogers TMM10i (ceramic thermoset polymer composite)
Layer Configuration	Double-sided (2-layer, no blind vias—simplifies fabrication and reduces defects)
Board Dimensions	70mm x 75mm per unit (tolerance: ±0.15mm for consistent assembly fit)
Minimum Trace/Space	6/4 mils (enables dense routing for compact RF/microwave designs)
Minimum Hole Size	0.3mm (supports miniaturized thru-hole components and precise via placement)
Finished Board Thickness	0.8mm (thin-profile for space-constrained applications like antennas)
Finished Copper Weight	1oz (1.4 mils, 35μm per outer layer—balances conductivity and design flexibility)
Via Plating Thickness	20μm (enhances thru-hole reliability and current-carrying capacity)
Surface Finish	Immersion tin (delivers corrosion resistance, low contact resistance, and excellent solderability)
Silkscreen (Top/Bottom)	No / No (optimized for unobstructed signal paths in high-frequency circuits)
Solder Mask (Top/Bottom)	No / No (avoids dielectric interference in microwave applications)
Quality Assurance	100% electrical testing prior to shipment (eliminates open circuits/shorts)

2. PCB Stac-kup

Layer/Component	Specification
Copper Layer 1	35μm (1oz)
Rogers TMM10i Core	0.762mm (30mil)
Copper Layer 2	35μm (1oz)

Rogers TMM10i PCB 30mil Substrate 1OZ Copper 0

3. Quality Standards

Artwork Format: Gerber RS-274-X

Quality Certification: IPC-Class-2

Global Availability: Supplied worldwide to support international projects

4. Rogers TMM10i Material: Key Attributes

TMM10i is a ceramic thermoset composite that merges ceramic’s dielectric stability with PTFE’s processability, ideal for microwave and RF circuits:

Core Features

Feature	Specification
Dielectric Constant (Dk)	9.80 ± 0.245 (isotropic—consistent across all axes for predictable signal behavior)
Dissipation Factor (Df)	0.0020 at 10GHz (ultra-low for minimal signal loss in high-frequency circuits)
Thermal Coefficient of Dk	-43 ppm/°K (stable dielectric properties across temperature fluctuations)
CTE (x/y/z)	19ppm/K, 19ppm/K, 20ppm/K (matched to copper—reduces thermal stress and delamination)
Decomposition Temperature (Td)	425°C (high thermal stability for harsh environments)
Thermal Conductivity	0.76 W/mK (efficient heat transfer for power amplifiers and high-power circuits)
Thickness Range	0.0015–0.500 inches (±0.0015”)—flexible for custom design needs

5. Key Benefits

-Mechanical Durability: Resists creep and cold flow, ensuring long-term structural stability.

-Chemical Resistance: Withstands process chemicals, reducing damage during fabrication.

-Simplified Plating: No sodium napthanate treatment required prior to electroless plating—lowers production costs.

-Reliable Wire-Bonding: Thermoset resin base enables secure wire-bond connections for high-frequency components.

6. Typical Applications

This PCB is optimized for applications demanding stable dielectric performance and high reliability:

-RF and microwave circuitry (e.g., signal amplifiers, oscillators)

-Power amplifiers and combiners (high thermal conductivity supports heat management)

-Filters and couplers (isotropic Dk ensures precise signal filtering)

-Satellite communication systems (resists harsh environmental conditions)

-Global Positioning Systems (GPS) Antennas (stable Dk for accurate signal reception)

-Patch Antennas (thin profile and low Df enhance antenna efficiency)

-Dielectric polarizers and lenses (consistent Dk for lightwave control)

-Chip testers (reliable thru-holes support repeated component testing)

Conclusion

This double-sided TMM10i PCB delivers the precision, stability, and durability required for high-frequency RF and microwave applications. It is a trusted solution for engineers seeking to optimize performance in circuits like antennas, power amplifiers, and satellite communications systems.

Rogers TMM10i PCB 30mil Substrate 1OZ Copper 1

Tags:

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

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Rogers TMM10i PCB 30mil Substrate 1OZ Copper

MOQ:	1pcs
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Arbeitstage
Zahlungsmethode:	T/t
Lieferkapazität:	5000 Prozent pro Monat

Einzelheiten

Produktbeschreibung

Einzelheiten

Herkunftsort

CHINA

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-052.V1.0

Grundmaterial:

Rogers TMM10i

Schichtzahl:

2-layer

Dicke der Leiterplatte:

0,8 mm

PCB -Größe:

70mm x 75mm

Kupfergewicht:

1oz (äquivalent zu 1,4 mil oder 35 μm)

Oberflächenbeschaffung:

Eintauchen

Min Bestellmenge:

1pcs

Preis:

USD9.99-99.99

Verpackung Informationen:

Vakuumbeutel+Kartons

Lieferzeit:

8-9 Arbeitstage

Zahlungsbedingungen:

T/t

Versorgungsmaterial-Fähigkeit:

5000 Prozent pro Monat

Hervorheben

Rogers TMM10i PCB board

30mil substrate PCB

1OZ copper Rogers PCB

Produktbeschreibung

Rogers TMM10i PCB 30mil Substrate 1OZ Copper

This double-sided (2-layer) rigid PCB is built with Rogers TMM10i, an isotropic thermoset microwave composite optimized for high-reliability RF and microwave applications.

1. PCB Specifications

Parameter	Specification
Base Material	Rogers TMM10i (ceramic thermoset polymer composite)
Layer Configuration	Double-sided (2-layer, no blind vias—simplifies fabrication and reduces defects)
Board Dimensions	70mm x 75mm per unit (tolerance: ±0.15mm for consistent assembly fit)
Minimum Trace/Space	6/4 mils (enables dense routing for compact RF/microwave designs)
Minimum Hole Size	0.3mm (supports miniaturized thru-hole components and precise via placement)
Finished Board Thickness	0.8mm (thin-profile for space-constrained applications like antennas)
Finished Copper Weight	1oz (1.4 mils, 35μm per outer layer—balances conductivity and design flexibility)
Via Plating Thickness	20μm (enhances thru-hole reliability and current-carrying capacity)
Surface Finish	Immersion tin (delivers corrosion resistance, low contact resistance, and excellent solderability)
Silkscreen (Top/Bottom)	No / No (optimized for unobstructed signal paths in high-frequency circuits)
Solder Mask (Top/Bottom)	No / No (avoids dielectric interference in microwave applications)
Quality Assurance	100% electrical testing prior to shipment (eliminates open circuits/shorts)

2. PCB Stac-kup

Layer/Component	Specification
Copper Layer 1	35μm (1oz)
Rogers TMM10i Core	0.762mm (30mil)
Copper Layer 2	35μm (1oz)

Rogers TMM10i PCB 30mil Substrate 1OZ Copper 0

3. Quality Standards

Artwork Format: Gerber RS-274-X

Quality Certification: IPC-Class-2

Global Availability: Supplied worldwide to support international projects

4. Rogers TMM10i Material: Key Attributes

TMM10i is a ceramic thermoset composite that merges ceramic’s dielectric stability with PTFE’s processability, ideal for microwave and RF circuits:

Core Features

Feature	Specification
Dielectric Constant (Dk)	9.80 ± 0.245 (isotropic—consistent across all axes for predictable signal behavior)
Dissipation Factor (Df)	0.0020 at 10GHz (ultra-low for minimal signal loss in high-frequency circuits)
Thermal Coefficient of Dk	-43 ppm/°K (stable dielectric properties across temperature fluctuations)
CTE (x/y/z)	19ppm/K, 19ppm/K, 20ppm/K (matched to copper—reduces thermal stress and delamination)
Decomposition Temperature (Td)	425°C (high thermal stability for harsh environments)
Thermal Conductivity	0.76 W/mK (efficient heat transfer for power amplifiers and high-power circuits)
Thickness Range	0.0015–0.500 inches (±0.0015”)—flexible for custom design needs