High-Performance 2-Layer Rogers RO3035 PCB with Immersion Gold

Rogers RO3035 ceramic-filled PTFE circuit materials are renowned for their outstanding properties, and this 2-layer rigid printed circuit board (PCB) capitalizes on these attributes to deliver high-performance results in high-frequency applications. Boasting optimized thickness, precise manufacturing parameters, and stable electrical performance across temperature fluctuations, it stands as the go-to choice for 5G, millimeter wave sub-6GHz, and massive MIMO systems.

1. PCB Specifications

2. PCB Stack-up Configuration

3. Quality Standards & Global Availability

This PCB adheres to industry-leading standards and is globally accessible, ensuring consistency, compatibility, and convenience for customers worldwide:

Artwork Format: Gerber RS-274-X

Accepted Quality Standard: IPC-Class-2

Availability: Global Accessibility

4. Rogers RO3035 Substrate: Introduction, Features & Benefits

4.1 Introduction to Rogers RO3035

Rogers RO3035 is a ceramic-filled, PTFE-based high-frequency circuit material designed to address the demands of modern wireless technologies. As part of the RO3000 series, it shares mechanical consistency with other RO3000 materials while offering a unique dielectric constant (Dk)—enabling engineers to develop multi-layer board designs without compromising on warping, reliability, or signal performance.

4.2 Key Features of Rogers RO3035

4.3 Core Benefits of Rogers RO3035

These features translate to tangible advantages for both design engineers and end-users, addressing key challenges in high-frequency system development:

High-Frequency Compatibility: Supports applications up to 30–40 GHz, making it ideal for 5G millimeter wave, automotive radar, and satellite communications systems.

Enhanced Power Amplifier Performance: Reduces operating temperatures and improves reliability in power amplifiers—critical for high-power wireless infrastructure.

Uniform Mechanical Properties: Compatible with a range of dielectric constants, enabling flexible multi-layer board designs and hybrid assemblies with epoxy glass multi-layer boards (simplifying integration of high-frequency and low-frequency circuits).

Copper-Matched Thermal Expansion: Low in-plane CTE matches copper, ensuring reliable surface-mounted assemblies (SMAs), excellent dimensional stability, and resistance to thermal fatigue—even in temperature-sensitive applications like automotive radar.

Cost-Effective Volume Production: Supports high-volume manufacturing processes with economical laminate pricing, reducing total production costs while maintaining premium performance.

5. Some Typical Applications

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

To sum up, this two-layer Rogers RO3035 PCB is made with great precision and meets industry quality standards. It uses a high-performance base material, providing an affordable and reliable option for future high-frequency applications.