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Taconic 31mil TLX-8 PCB 2-layer Immersion Gold

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Taconic 31mil TLX-8 PCB 2-layer Immersion Gold

MOQ:	1Stk
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Arbeitstage
Zahlungsmethode:	T/T
Lieferkapazität:	5000 Prozent pro Monat

Einzelheiten Informationen

Produktbeschreibung

Einzelheiten

Herkunftsort

China

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-332.V1.0

Grundmaterial:

Taconic TLX-8

Schichtzahl:

2 Schichten

Dicke der Leiterplatte:

0,8 mm

PCB-Größe:

25 mm x 71 mm (1 Stück) ± 0,15 mm

Seidenbildschirm:

Lötmaske:

Kupfergewicht:

1oz (1,4 mil) für die Außenschichten

Oberflächenbeschaffenheit:

Eintauchen Gold

Hervorheben:

Taconic TLX-8 PCB immersion gold

2-layer Taconic PCB with warranty

31mil Taconic PCB for electronics

Produktbeschreibung

Taconic 31mil TLX-8 PCB 2-layer Immersion Gold

This high-reliability 2-layer PCB leverages Taconic TLX-8, a top-tier PTFE fiberglass laminate specifically crafted for robust RF and microwave operations. Engineered to withstand harsh conditions--ranging from intense vibrations to radiation exposure and extreme temperature fluctuations--it boasts exceptional Passive Intermodulation (PIM) performance, consistent dielectric characteristics, and superior dimensional stability, fully complying with IPC-Class-2 quality benchmarks.

PCB Specification

Parameter	Details
Base Material	Taconic TLX-8 (PTFE fiberglass laminate)
Layer Count	2-layer rigid PCB
Board Dimensions	25mm x 71mm (1 piece)±0.15mm
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.3mm
Via Type	No blind vias (thru-hole vias only)
Finished Board Thickness	0.8mm
Finished Copper Weight (Outer Layers)	1oz (equivalent to 1.4 mils / 35 μm per layer)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold - ensures corrosion resistance, reliable soldering, and long-term contact integrity
Silkscreen	Top: White; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up Details

Layer Type	Material/Description	Thickness
Copper Layer 1 (Outer)	Conductive copper (finished)	35 μm (1oz)
Dielectric Core	Taconic TLX-8	0.787 mm (31 mils)
Copper Layer 2 (Outer)	Conductive copper (finished)	35 μm (1oz)

Material Overview: Taconic TLX-8

Taconic TLX-8 is a versatile PTFE fiberglass laminate designed for high-volume antenna and microwave applications, where reliability in extreme environments is critical. Its formulation balances mechanical reinforcement (from fiberglass) with the low-loss properties of PTFE, making it suitable for low-layer-count designs that endure harsh conditions--including high vibration (e.g., space launch), extreme temperatures (e.g., engine modules, altimeters), radiation (e.g., space systems), and marine exposure (e.g., warship antennas). With a wide range of available thicknesses and copper cladding options, it offers flexibility for diverse RF/microwave design needs while maintaining tight control over dielectric properties.

Main Material Properties

Property Category	Specification	Value	Test Standard
Electrical Properties	Dielectric Constant (Dk) @ 10 GHz	2.55 ± 0.04	IPC-650 2.5.5.3
	Dissipation Factor (DF) @ 10 GHz	0.0018	IPC-650 2.5.5.5.1
	Surface Resistivity (Elevated Temp.)	6.605 x 10⁸ Mohm	IPC-650 2.5.17.1 Sec. 5.2.1
	Surface Resistivity (Humidity Cond.)	3.550 x 10⁶ Mohm	IPC-650 2.5.17.1 Sec. 5.2.1
	Volume Resistivity (Elevated Temp.)	1.110 x 10¹⁰ Mohm/cm	IPC-650 2.5.17.1 Sec. 5.2.1
	Volume Resistivity (Humidity Cond.)	1.046 x 10¹⁰ Mohm/cm	IPC-650 2.5.17.1 Sec. 5.2.1
Electrical Properties	Dielectric Breakdown	>45 Kv	IPC-650 2.5.6
Dimensional Stability	MD After Bake	0.06 mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.4
	CD After Bake	0.08 mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.4
	MD Thermal Stress	0.09 mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.5
	CD Thermal Stress	0.10 mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.5
Thermal Properties	CTE (25-260 °C) - X-axis	21 ppm/°C	IPC-650 2.4.41 / ASTM D 3386
	CTE (25-260 °C) - Y-axis	23 ppm/°C	IPC-650 2.4.41 / ASTM D 3386
	CTE (25-260 °C) - Z-axis	215 ppm/°C	IPC-650 2.4.41 / ASTM D 3386
	Decomposition Temp. (Td) - 2% Weight Loss	535 °C	IPC-650 2.4.24.6 (TGA)
	Decomposition Temp. (Td) - 5% Weight Loss	553 °C	IPC-650 2.4.24.6 (TGA)
Chemical/Physical Properties	Moisture Absorption	0.02%	IPC-650 2.6.2.1
Chemical/Physical Properties	Flammability Rating	UL 94 V-0	UL-94

Core Benefits

Exceptional PIM Performance: Measures lower than -160 dBc*, critical for minimizing signal interference in RF/microwave systems (e.g., radar, mobile communications).
Extreme Environment Resistance: Withstands high vibration, extreme temperatures, radiation, and marine exposure--ideal for space, aerospace, and naval applications.
Stable Electrical Properties: Low and tightly controlled Dk (2.55 ± 0.04) and low DF (0.0018) ensure consistent signal integrity across wide frequency ranges.
Dimensional Stability: Minimal expansion/contraction under thermal stress or baking prevents PCB warpage, preserving component alignment and connection reliability.
Low Moisture Absorption: 0.02% absorption eliminates moisture-related performance degradation, even in humid environments.
Mechanical Robustness: Fiberglass reinforcement provides durability for designs requiring structural resilience (e.g., bolted PCBs in launch vehicles).
UL 94 V-0 Rating: Enhances safety by resisting flame spread, suitable for critical systems where fire risk mitigation is key.

Typical Applications

This PCB is optimized for high-reliability RF/microwave systems, including:

Radar systems
Mobile communications equipment
Microwave test equipment
Microwave transmission devices
Couplers, splitters, combiners, and amplifiers
Antennas (e.g., space, naval, aerospace)

Tags:

Produits

MOQ:	1Stk
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Arbeitstage
Zahlungsmethode:	T/T
Lieferkapazität:	5000 Prozent pro Monat

Einzelheiten

Produktbeschreibung

Einzelheiten

Herkunftsort

China

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-332.V1.0

Grundmaterial:

Taconic TLX-8

Schichtzahl:

2 Schichten

Dicke der Leiterplatte:

0,8 mm

PCB-Größe:

25 mm x 71 mm (1 Stück) ± 0,15 mm

Seidenbildschirm:

Weiß

Lötmaske:

NEIN

Kupfergewicht:

1oz (1,4 mil) für die Außenschichten

Oberflächenbeschaffenheit:

Eintauchen Gold

Min Bestellmenge:

1Stk

Preis:

USD9.99-99.99

Verpackung Informationen:

Vakuumbeutel+Kartons

Lieferzeit:

8-9 Arbeitstage

Zahlungsbedingungen:

T/T

Versorgungsmaterial-Fähigkeit:

5000 Prozent pro Monat

Hervorheben

Taconic TLX-8 PCB immersion gold

2-layer Taconic PCB with warranty

31mil Taconic PCB for electronics

Produktbeschreibung

Taconic 31mil TLX-8 PCB 2-layer Immersion Gold

PCB Specification

Parameter	Details
Base Material	Taconic TLX-8 (PTFE fiberglass laminate)
Layer Count	2-layer rigid PCB
Board Dimensions	25mm x 71mm (1 piece)±0.15mm
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.3mm
Via Type	No blind vias (thru-hole vias only)
Finished Board Thickness	0.8mm
Finished Copper Weight (Outer Layers)	1oz (equivalent to 1.4 mils / 35 μm per layer)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold - ensures corrosion resistance, reliable soldering, and long-term contact integrity
Silkscreen	Top: White; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

PCB Stack-up Details

Layer Type	Material/Description	Thickness
Copper Layer 1 (Outer)	Conductive copper (finished)	35 μm (1oz)
Dielectric Core	Taconic TLX-8	0.787 mm (31 mils)
Copper Layer 2 (Outer)	Conductive copper (finished)	35 μm (1oz)

Material Overview: Taconic TLX-8

Main Material Properties

Property Category	Specification	Value	Test Standard
Electrical Properties	Dielectric Constant (Dk) @ 10 GHz	2.55 ± 0.04	IPC-650 2.5.5.3
	Dissipation Factor (DF) @ 10 GHz	0.0018	IPC-650 2.5.5.5.1
	Surface Resistivity (Elevated Temp.)	6.605 x 10⁸ Mohm	IPC-650 2.5.17.1 Sec. 5.2.1
	Surface Resistivity (Humidity Cond.)	3.550 x 10⁶ Mohm	IPC-650 2.5.17.1 Sec. 5.2.1
	Volume Resistivity (Elevated Temp.)	1.110 x 10¹⁰ Mohm/cm	IPC-650 2.5.17.1 Sec. 5.2.1
	Volume Resistivity (Humidity Cond.)	1.046 x 10¹⁰ Mohm/cm	IPC-650 2.5.17.1 Sec. 5.2.1
Electrical Properties	Dielectric Breakdown	>45 Kv	IPC-650 2.5.6
Dimensional Stability	MD After Bake	0.06 mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.4
	CD After Bake	0.08 mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.4
	MD Thermal Stress	0.09 mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.5
	CD Thermal Stress	0.10 mm/M (mils/in)	IPC-650 2.4.39 Sec. 5.5
Thermal Properties	CTE (25-260 °C) - X-axis	21 ppm/°C	IPC-650 2.4.41 / ASTM D 3386
	CTE (25-260 °C) - Y-axis	23 ppm/°C	IPC-650 2.4.41 / ASTM D 3386
	CTE (25-260 °C) - Z-axis	215 ppm/°C	IPC-650 2.4.41 / ASTM D 3386
	Decomposition Temp. (Td) - 2% Weight Loss	535 °C	IPC-650 2.4.24.6 (TGA)
	Decomposition Temp. (Td) - 5% Weight Loss	553 °C	IPC-650 2.4.24.6 (TGA)
Chemical/Physical Properties	Moisture Absorption	0.02%	IPC-650 2.6.2.1
Chemical/Physical Properties	Flammability Rating	UL 94 V-0	UL-94

Core Benefits

Exceptional PIM Performance: Measures lower than -160 dBc*, critical for minimizing signal interference in RF/microwave systems (e.g., radar, mobile communications).
Extreme Environment Resistance: Withstands high vibration, extreme temperatures, radiation, and marine exposure--ideal for space, aerospace, and naval applications.
Stable Electrical Properties: Low and tightly controlled Dk (2.55 ± 0.04) and low DF (0.0018) ensure consistent signal integrity across wide frequency ranges.
Dimensional Stability: Minimal expansion/contraction under thermal stress or baking prevents PCB warpage, preserving component alignment and connection reliability.
Low Moisture Absorption: 0.02% absorption eliminates moisture-related performance degradation, even in humid environments.
Mechanical Robustness: Fiberglass reinforcement provides durability for designs requiring structural resilience (e.g., bolted PCBs in launch vehicles).
UL 94 V-0 Rating: Enhances safety by resisting flame spread, suitable for critical systems where fire risk mitigation is key.

Typical Applications

This PCB is optimized for high-reliability RF/microwave systems, including:

Radar systems
Mobile communications equipment
Microwave test equipment
Microwave transmission devices
Couplers, splitters, combiners, and amplifiers
Antennas (e.g., space, naval, aerospace)

Tags:

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

Brett PWB-fr4

PWB-Schablone

Metallkern PWB

Taconic 31mil TLX-8 PCB 2-layer Immersion Gold

Taconic TLX-8 PCB immersion gold

2-layer Taconic PCB with warranty

31mil Taconic PCB for electronics

HASL Rf-PWB-Brett,

Takonisches Telex-Rf-PWB-Brett,

Rf-PWB-Brett

Rogers PWB-Brett

PTFE PWB-Brett

Hohes Tg PWB

Multi Schicht PWB

Takonisches PWB

HDI PWB-Brett

Hochgeschwindigkeits-PWB

Widerstand steuerte PWB

Flexibles PWB-Brett

Brett PWB-fr4

PWB-Schablone

Metallkern PWB

Taconic TLX-8 PCB immersion gold

2-layer Taconic PCB with warranty

31mil Taconic PCB for electronics

HASL Rf-PWB-Brett,

Takonisches Telex-Rf-PWB-Brett,