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50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

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Metallkern PWB

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Ms. Ivy Deng

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50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

MOQ:	1pcs
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Arbeitstage
Zahlungsmethode:	T/t
Lieferkapazität:	5000 Prozent pro Monat

Einzelheiten Informationen

Produktbeschreibung

Einzelheiten

Herkunftsort

CHINA

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-052.V1.0

Grundmaterial:

Taconic TLX-9

Schichtzahl:

2-layer

Dicke der Leiterplatte:

1,35 mm

PCB -Größe:

57 mm x 136 mm (Toleranz: ±0,15 mm)

Kupfergewicht:

1oz (1,4 mil) auf den Außenschichten

Oberflächenbeschaffung:

Eintauchen

Hervorheben:

Taconic TLX-9 RF PCB

2-layer immersion tin PCB

50mil Taconic PCB board

Produktbeschreibung

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

This 2-layer rigid PCB is crafted from Taconic TLX-9, a PTFE/woven glass laminate. This material is highly valued for its exceptional electrical and mechanical stability, making it a top choice for applications where consistent performance and reliability are critical.

1. PCB Specifications

This 2-layer rigid PCB is meticulously crafted with specifications optimized for precision and performance:

Parameter	Specification
Base Material	Taconic TLX-9 (PTFE/woven glass composite)
Layer Configuration	2 outer layers (no blind vias)
Dimensions	57mm x 136mm per unit (tolerance: ±0.15mm)
Trace/Space	Minimum 6/6 mils (ensuring signal integrity in dense layouts)
Minimum Hole Size	0.3mm (supports compact component mounting)
Finished Thickness	1.35mm (balanced rigidity and versatility)
Copper Weight	1oz (1.4 mils) on outer layers (35μm per copper layer)
Via Plating	20μm thickness (enhances conductivity and durability)
Surface Finish	Immersion tin (corrosion resistance and solderability)
Silkscreen & Solder Mask	White top silkscreen (for component identification); no bottom silkscreen or solder mask (optimized for specific mounting needs)
Quality Assurance	Printed series numbers for traceability + 100% electrical testing prior to shipment (eliminates defects in critical applications)

2. PCB Stack-up

Layer/Component	Specification
Copper Layer 1	35μm
Taconic TLX-9 Core	1.27mm (50mil)
Copper Layer 2	35μm

3. Artwork & Quality Standards

Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication)

Quality Certification: IPC-Class-2 (meets rigorous acceptability criteria)

Global Availability: Supplied worldwide to support international project requirements

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish 0

4. TLX-9 Material: Overview & Key Properties

Taconic TLX-9 is a PTFE/woven glass laminate engineered for precision electronics, offering exceptional processability (shearing, drilling, milling, plating) using standard PTFE fabrication methods. Its dimensional stability and near-zero moisture absorption (<0.02%) during manufacturing make it ideal for high-reliability applications. Below are its critical technical properties (measured at 10 GHz unless noted):

Property	Specification
Dielectric Constant (DK)	2.5 (tightly controlled across frequency/temperature)
Dissipation Factor (DF)	0.0019
Moisture Absorption	<0.02%
Dielectric Breakdown	>60 kV
Volume Resistivity	10⁷ Mohm/cm
Surface Resistivity	10⁷ Mohm
Arc Resistance	>180 seconds
Flexural Strength (Lengthwise)	>23,000 lbs./in.
Flexural Strength (Crosswise)	>19,000 lbs./in.
Peel Strength (1oz copper)	12 lbs./linear in.
Thermal Conductivity	0.19 W/m/K
x-y CTE	9-12 ppm/°C
z CTE	130-145 ppm/°C
UL-94 Flammability Rating	V-0 (flame-retardant)

5. Core Benefits of TLX-9 PCB

This PCB leverages TLX-9’s inherent advantages to deliver superior performance:

Low Dielectric Constant (2.5): Minimizes signal loss and crosstalk in high-frequency applications.

Low Dissipation Factor (0.0019): Ensures efficient power transfer with minimal energy waste.

Near-Zero Moisture Absorption: Prevents performance degradation from environmental humidity.

High Dielectric Breakdown (>60 kV): Supports high-voltage operation without insulation failure.

Strong Peel Strength (12 lbs./linear in.): Enhances bond reliability between copper layers and substrate.

Controlled CTE: Matches thermal expansion of components (x-y CTE: 9-12 ppm/°C), reducing stress during temperature cycling.

6. Typical Applications

The combination of TLX-9’s properties and the PCB’s precision construction makes it ideal for:

-Low-Noise Amplifiers (LNAs), Low-Noise Blocks (LNBs), and Low-Noise Converters (LNCs)

-Personal Communications Service (PCS)/Personal Communications Network (PCN) systems

-Large Format Antennas

-High Power Amplifiers

-Passive Components (resistors, capacitors, inductors) for high-frequency circuits

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish 1

Tags:

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

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50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

MOQ:	1pcs
Preis:	USD9.99-99.99
Standardverpackung:	Vakuumbeutel+Kartons
Lieferfrist:	8-9 Arbeitstage
Zahlungsmethode:	T/t
Lieferkapazität:	5000 Prozent pro Monat

Einzelheiten

Produktbeschreibung

Einzelheiten

Herkunftsort

CHINA

Markenname

Bicheng

Zertifizierung

UL, ISO9001, IATF16949

Modellnummer

BIC-052.V1.0

Grundmaterial:

Taconic TLX-9

Schichtzahl:

2-layer

Dicke der Leiterplatte:

1,35 mm

PCB -Größe:

57 mm x 136 mm (Toleranz: ±0,15 mm)

Kupfergewicht:

1oz (1,4 mil) auf den Außenschichten

Oberflächenbeschaffung:

Eintauchen

Min Bestellmenge:

1pcs

Preis:

USD9.99-99.99

Verpackung Informationen:

Vakuumbeutel+Kartons

Lieferzeit:

8-9 Arbeitstage

Zahlungsbedingungen:

T/t

Versorgungsmaterial-Fähigkeit:

5000 Prozent pro Monat

Hervorheben

Taconic TLX-9 RF PCB

2-layer immersion tin PCB

50mil Taconic PCB board

Produktbeschreibung

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish

1. PCB Specifications

This 2-layer rigid PCB is meticulously crafted with specifications optimized for precision and performance:

Parameter	Specification
Base Material	Taconic TLX-9 (PTFE/woven glass composite)
Layer Configuration	2 outer layers (no blind vias)
Dimensions	57mm x 136mm per unit (tolerance: ±0.15mm)
Trace/Space	Minimum 6/6 mils (ensuring signal integrity in dense layouts)
Minimum Hole Size	0.3mm (supports compact component mounting)
Finished Thickness	1.35mm (balanced rigidity and versatility)
Copper Weight	1oz (1.4 mils) on outer layers (35μm per copper layer)
Via Plating	20μm thickness (enhances conductivity and durability)
Surface Finish	Immersion tin (corrosion resistance and solderability)
Silkscreen & Solder Mask	White top silkscreen (for component identification); no bottom silkscreen or solder mask (optimized for specific mounting needs)
Quality Assurance	Printed series numbers for traceability + 100% electrical testing prior to shipment (eliminates defects in critical applications)

2. PCB Stack-up

Layer/Component	Specification
Copper Layer 1	35μm
Taconic TLX-9 Core	1.27mm (50mil)
Copper Layer 2	35μm

3. Artwork & Quality Standards

Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication)

Quality Certification: IPC-Class-2 (meets rigorous acceptability criteria)

Global Availability: Supplied worldwide to support international project requirements

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish 0

4. TLX-9 Material: Overview & Key Properties

Property	Specification
Dielectric Constant (DK)	2.5 (tightly controlled across frequency/temperature)
Dissipation Factor (DF)	0.0019
Moisture Absorption	<0.02%
Dielectric Breakdown	>60 kV
Volume Resistivity	10⁷ Mohm/cm
Surface Resistivity	10⁷ Mohm
Arc Resistance	>180 seconds
Flexural Strength (Lengthwise)	>23,000 lbs./in.
Flexural Strength (Crosswise)	>19,000 lbs./in.
Peel Strength (1oz copper)	12 lbs./linear in.
Thermal Conductivity	0.19 W/m/K
x-y CTE	9-12 ppm/°C
z CTE	130-145 ppm/°C
UL-94 Flammability Rating	V-0 (flame-retardant)

5. Core Benefits of TLX-9 PCB

This PCB leverages TLX-9’s inherent advantages to deliver superior performance:

Low Dielectric Constant (2.5): Minimizes signal loss and crosstalk in high-frequency applications.

Low Dissipation Factor (0.0019): Ensures efficient power transfer with minimal energy waste.

Near-Zero Moisture Absorption: Prevents performance degradation from environmental humidity.

High Dielectric Breakdown (>60 kV): Supports high-voltage operation without insulation failure.

Strong Peel Strength (12 lbs./linear in.): Enhances bond reliability between copper layers and substrate.

Controlled CTE: Matches thermal expansion of components (x-y CTE: 9-12 ppm/°C), reducing stress during temperature cycling.

6. Typical Applications

The combination of TLX-9’s properties and the PCB’s precision construction makes it ideal for:

-Low-Noise Amplifiers (LNAs), Low-Noise Blocks (LNBs), and Low-Noise Converters (LNCs)

-Personal Communications Service (PCS)/Personal Communications Network (PCN) systems

-Large Format Antennas

-High Power Amplifiers

-Passive Components (resistors, capacitors, inductors) for high-frequency circuits

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish 1

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