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Double-Sided Aluminum PCB with Immersion Gold

Double-Sided Aluminum PCB with Immersion Gold

MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Werktage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Stück pro Monat
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-200.V1.0
Grundmaterial:
Aluminium
Anzahl der Ebenen:
Doppelseitig
PCB-Dicke:
1,65 mm ± 10 %
PCB-Größe:
68 mm × 54 mm
Kupfergewicht:
1 Unze
Oberflächenbeschaffenheit:
Immersionsgold (ENIG), 2u" Golddicke
Lötmaske:
Grün
Siebdruck:
NEIN
Hervorheben:

double-sided aluminum PCB

,

immersion gold PCB

,

metal core PCB with warranty

Produktbeschreibung

This printed circuit board (PCB) features a double-sided sandwich aluminum substrate configuration, specifically engineered for high-heat-dissipation applications. It adheres to strict dimensional and performance criteria to fulfill the operational requirements of high-reliability electronic systems.

 

PCB Specifications

Construction Parameter Specification
PCB Type Double-Sided Sandwich Aluminum PCB
Thermal Conductivity > 2 W/mK
Finished Board Thickness 1.65mm ± 10%
Copper Thickness 1oz
Surface Finish Immersion Gold (ENIG), 2u" Gold Thickness
Solder Mask Double-sided Green Solder Mask
Board Dimensions 68mm × 54mm

 

Double-Sided Aluminum PCB with Immersion Gold 0

 

What is a Metal Core Printed Circuit Board (MCPCB)?

A Metal Core Printed Circuit Board (MCPCB) is a specialized type of PCB that utilizes a metal substrate—most commonly aluminum, though copper or iron may also be used—as its core, replacing the traditional FR-4 insulating substrate. Its primary function is to enhance heat dissipation, addressing the issue of heat buildup in high-power electronic components such as LEDs and power amplifiers. Acting as a heat conductor, the metal core efficiently transfers heat generated by components to an external heat sink, thereby improving component reliability and extending their service life. In comparison to conventional PCBs, MCPCBs offer superior thermal conductivity, mechanical strength, and electromagnetic shielding capabilities.

 

Differences Between Double-Layer Sandwich Aluminum Substrate and Double-Layer Single-Side Aluminum Substrate

Double-Layer Sandwich Aluminum Substrate

Structural Features: The core of this substrate is a layer of aluminum. Insulating layers (e.g., PP, PI) are attached to both the upper and lower surfaces of the aluminum core, with a layer of copper foil pressed onto the outer side of each insulating layer to form two separate upper and lower circuit layers.

Layer Type Material Thickness (mm) Remarks
1 Solder Mask Solder Mask 0.015 Top Protective Layer
2 Copper Foil Copper 0.035 Top Circuit Layer
3 Prepreg 2W/MK Prepreg 0.075 High Thermal Conductivity Dielectric Layer
4 Metal Substrate Aluminum Core 1.4 Metal Substrate Core, Main Thermal Conductive Layer
5 Prepreg 2W/MK Prepreg 0.075 High Thermal Conductivity Dielectric Layer
6 Copper Foil Copper 0.035 Bottom Circuit Layer
7 Solder Mask Solder Mask 0.015 Bottom Protective Layer
Total Thickness - - 1.65 Total Thickness After Lamination

 

Double-Sided Aluminum PCB with Immersion Gold 1

 

Simple Understanding: The aluminum core is positioned in the middle, with circuit layers on both sides—similar to a "sandwich cookie," where the aluminum serves as the filling and the two copper layers act as the cookie layers. Both sides can conduct heat to the aluminum core, enabling uniform heat dissipation across the entire board.

 

Double-Layer Single-Side Aluminum Substrate

Structural Features: Unlike the sandwich structure, this type of substrate only has an aluminum substrate on one side to serve as the heat dissipation layer, while the other side is made of ordinary insulating materials such as FR-4. Although it has two copper foil layers (located on the top first and second layers), only the side with the aluminum substrate can effectively conduct heat to the aluminum core.

 

Layer Type Material Thickness (mm) Remarks
L1 Copper Foil Copper 0.07 Top Circuit Layer, Through-hole Connection
- Dielectric Layer 2W/MK Prepreg 0.12 High Thermal Conductivity Material
L2 Copper Foil Copper 0.07 Bottom Circuit Layer, Through-hole Connection
- Dielectric Layer 2W/MK Prepreg 0.12 High Thermal Conductivity Material
- Metal Substrate Aluminum Core 2.8 Lamination Thickness, Main Thermal Conductive Layer
Total Thickness - - 3.18 Total Thickness After Lamination

 

Double-Sided Aluminum PCB with Immersion Gold 2

 

Simple Understanding: Aluminum is only present on one side of the board, and the opposite side does not contribute to heat dissipation. It can be visualized as a "double-layer board with aluminum on one side," where the heat dissipation effect is limited to the side containing the aluminum core.

 

Double-Sided Aluminum PCB with Immersion Gold 3

produits
EINZELHEITEN ZU DEN PRODUKTEN
Double-Sided Aluminum PCB with Immersion Gold
MOQ: 1Stk
Preis: USD9.99-99.99
Standardverpackung: Vakuumbeutel+Kartons
Lieferfrist: 8-9 Werktage
Zahlungsmethode: T/T
Lieferkapazität: 5000 Stück pro Monat
Einzelheiten
Herkunftsort
China
Markenname
Bicheng
Zertifizierung
UL, ISO9001, IATF16949
Modellnummer
BIC-200.V1.0
Grundmaterial:
Aluminium
Anzahl der Ebenen:
Doppelseitig
PCB-Dicke:
1,65 mm ± 10 %
PCB-Größe:
68 mm × 54 mm
Kupfergewicht:
1 Unze
Oberflächenbeschaffenheit:
Immersionsgold (ENIG), 2u" Golddicke
Lötmaske:
Grün
Siebdruck:
NEIN
Min Bestellmenge:
1Stk
Preis:
USD9.99-99.99
Verpackung Informationen:
Vakuumbeutel+Kartons
Lieferzeit:
8-9 Werktage
Zahlungsbedingungen:
T/T
Versorgungsmaterial-Fähigkeit:
5000 Stück pro Monat
Hervorheben

double-sided aluminum PCB

,

immersion gold PCB

,

metal core PCB with warranty

Produktbeschreibung

This printed circuit board (PCB) features a double-sided sandwich aluminum substrate configuration, specifically engineered for high-heat-dissipation applications. It adheres to strict dimensional and performance criteria to fulfill the operational requirements of high-reliability electronic systems.

 

PCB Specifications

Construction Parameter Specification
PCB Type Double-Sided Sandwich Aluminum PCB
Thermal Conductivity > 2 W/mK
Finished Board Thickness 1.65mm ± 10%
Copper Thickness 1oz
Surface Finish Immersion Gold (ENIG), 2u" Gold Thickness
Solder Mask Double-sided Green Solder Mask
Board Dimensions 68mm × 54mm

 

Double-Sided Aluminum PCB with Immersion Gold 0

 

What is a Metal Core Printed Circuit Board (MCPCB)?

A Metal Core Printed Circuit Board (MCPCB) is a specialized type of PCB that utilizes a metal substrate—most commonly aluminum, though copper or iron may also be used—as its core, replacing the traditional FR-4 insulating substrate. Its primary function is to enhance heat dissipation, addressing the issue of heat buildup in high-power electronic components such as LEDs and power amplifiers. Acting as a heat conductor, the metal core efficiently transfers heat generated by components to an external heat sink, thereby improving component reliability and extending their service life. In comparison to conventional PCBs, MCPCBs offer superior thermal conductivity, mechanical strength, and electromagnetic shielding capabilities.

 

Differences Between Double-Layer Sandwich Aluminum Substrate and Double-Layer Single-Side Aluminum Substrate

Double-Layer Sandwich Aluminum Substrate

Structural Features: The core of this substrate is a layer of aluminum. Insulating layers (e.g., PP, PI) are attached to both the upper and lower surfaces of the aluminum core, with a layer of copper foil pressed onto the outer side of each insulating layer to form two separate upper and lower circuit layers.

Layer Type Material Thickness (mm) Remarks
1 Solder Mask Solder Mask 0.015 Top Protective Layer
2 Copper Foil Copper 0.035 Top Circuit Layer
3 Prepreg 2W/MK Prepreg 0.075 High Thermal Conductivity Dielectric Layer
4 Metal Substrate Aluminum Core 1.4 Metal Substrate Core, Main Thermal Conductive Layer
5 Prepreg 2W/MK Prepreg 0.075 High Thermal Conductivity Dielectric Layer
6 Copper Foil Copper 0.035 Bottom Circuit Layer
7 Solder Mask Solder Mask 0.015 Bottom Protective Layer
Total Thickness - - 1.65 Total Thickness After Lamination

 

Double-Sided Aluminum PCB with Immersion Gold 1

 

Simple Understanding: The aluminum core is positioned in the middle, with circuit layers on both sides—similar to a "sandwich cookie," where the aluminum serves as the filling and the two copper layers act as the cookie layers. Both sides can conduct heat to the aluminum core, enabling uniform heat dissipation across the entire board.

 

Double-Layer Single-Side Aluminum Substrate

Structural Features: Unlike the sandwich structure, this type of substrate only has an aluminum substrate on one side to serve as the heat dissipation layer, while the other side is made of ordinary insulating materials such as FR-4. Although it has two copper foil layers (located on the top first and second layers), only the side with the aluminum substrate can effectively conduct heat to the aluminum core.

 

Layer Type Material Thickness (mm) Remarks
L1 Copper Foil Copper 0.07 Top Circuit Layer, Through-hole Connection
- Dielectric Layer 2W/MK Prepreg 0.12 High Thermal Conductivity Material
L2 Copper Foil Copper 0.07 Bottom Circuit Layer, Through-hole Connection
- Dielectric Layer 2W/MK Prepreg 0.12 High Thermal Conductivity Material
- Metal Substrate Aluminum Core 2.8 Lamination Thickness, Main Thermal Conductive Layer
Total Thickness - - 3.18 Total Thickness After Lamination

 

Double-Sided Aluminum PCB with Immersion Gold 2

 

Simple Understanding: Aluminum is only present on one side of the board, and the opposite side does not contribute to heat dissipation. It can be visualized as a "double-layer board with aluminum on one side," where the heat dissipation effect is limited to the side containing the aluminum core.

 

Double-Sided Aluminum PCB with Immersion Gold 3

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