Brief introduction
RO3203 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials have been specifically engineered to provide exceptional electrical performance and mechanical stability while remaining cost-effective. As an extension of the RO3000 series, RO3203 materials stand out with their enhanced mechanical stability.
With a dielectric constant of 3.02 and a dissipation factor of 0.0016, RO3203 materials enable an extended useful frequency range beyond 40 GHz.
Features
RO3203 has a thermal conductivity of 0.48 W/mK, indicating its ability to conduct heat.
The volume resistivity is 107 MΩ.cm and surface resistivity of the material is also 107 MΩ.
RO3203 exhibits a dimensional stability of 0.8 mm/m in the X and Y directions and it has a moisture absorption rate of less than 0.1%, indicating its ability to resist absorbing moisture when exposed to specific conditions.
The material has different coefficients of thermal expansion in three directions. The Z-direction coefficient is 58 ppm/℃, while the X and Y-direction coefficients are both 13 ppm/℃.
RO3203 has a Thermal Decomposition Temperature (Td) of 500℃ and a density of 2.1 gm/cm3 at 23℃.
After soldering, the material exhibits a copper peel strength of 10.2 lbs/in and a flammability rating of V-0 according to the UL 94 standard, while also being compatible with lead-free processes.
| Property |
RO3203 |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant,εProcess |
3.02±0.04 |
Z |
- |
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| Dielectric Constant,εDesign |
3.02 |
Z |
- |
8 GHz - 40 GHz |
Differential
Phase Length
Method |
| Dissipation Factor, tan d |
0.0016 |
Z |
- |
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| Thermal Conductivity |
0.48 |
|
W/mK |
Float 100℃ |
ASTM C518 |
| Volume Resistivity |
107 |
|
MΩ.cm |
A |
ASTM D257 |
| Surface Resistivity |
107 |
|
MΩ |
A |
ASTM D257 |
| Dimensional Stability |
0.8 |
X, Y |
mm/m |
COND A |
IPC-TM-650 2.4.3.9 |
| Moisure Absorption |
<0.1 |
|
% |
D24/23 |
IPC-TM-650 2.6.2.1 |
| Coefficient of Thermal Expansion |
58 13 |
Z X,Y |
ppm/℃ |
-50 ℃to 288℃ |
ASTM D3386 |
| Td |
500 |
|
℃ |
TGA |
ASTM D3850 |
| Density |
2.1 |
|
gm/cm3 |
23℃ |
ASTM D792 |
| Copper Peel Stength |
10.2 |
|
lbs/in |
After solder |
IPC-TM-650 2.4.8 |
| Flammability |
V-0 |
|
|
|
UL 94 |
| Lead-Free Process Compatible |
Yes |
|
|
|
|
PCB Capability
We can provide PCBs with single-layer, double-layer, multi-layer, and hybrid configurations, catering to different design requirements
We accommodate different copper weights, such as 1oz (35µm) and 2oz (70µm) and different thicknesses, including 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm) etc.
We have the capability to accommodate boards with dimensions as large as 400mm X 500mm. Meanwhile, we offer a range of solder mask colors, including green, black, blue, yellow, red, and more.
Our surface finish options include bare copper, HASL, Immersion tin, Immersion silver, ENIG, OSP, Pure gold, ENEPIG, and others
| PCB Material: |
Ceramic-filled Laminates Reinforced with Woven Fiberglass |
| Designation: |
RO3203 |
| Dielectric constant: |
3.02±0.04 |
| Layer count: |
Single-layer, Double-layer, Multi-layer, Hybrid PCB |
| Copper weight: |
1oz (35µm), 2oz (70µm) |
| PCB thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, Immersion tin, Immersion silver, ENIG, OSP, Pure gold, ENEPIG etc.. |
Applications
RO3203 PCB finds applications in a wide range of industries and technologies, including automotive collision avoidance systems, GPS antennas, microstrip patch antennas, direct broadcast satellites, and remote meter readers etc.
Ihre Nachricht muss zwischen 20 und 3.000 Zeichen enthalten!
